Nanostructure formation of Cu/Si(100) thin film induced by ion beam bombardment

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

“…modified by plasma have many applications in the field of automobiles, printed circuit board manufacturing, and electromagnetic interference shielding materials [12]. Metal surface modification by plasma on polycrystalline Cu has created a lot of interest to form ordered nanostructures [13][14][15]. The nanostructure formation by plasma treatment has been investigated intensively [16], but the majority of studies focused on patterning the surfaces of bulk materials and few studies have been reported on thin metal films [13,15].…”

“…Metal surface modification by plasma on polycrystalline Cu has created a lot of interest to form ordered nanostructures [13][14][15]. The nanostructure formation by plasma treatment has been investigated intensively [16], but the majority of studies focused on patterning the surfaces of bulk materials and few studies have been reported on thin metal films [13,15]. The microstructure such as the distribution of grains and grain orientation in polycrystalline thin films generally affects the properties, performance, and reliability of thin films [17].…”