1988
DOI: 10.1147/rd.324.0462
|View full text |Cite
|
Sign up to set email alerts
|

Nanostructure technology

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
17
0

Year Published

1988
1988
2010
2010

Publication Types

Select...
5
3
1

Relationship

0
9

Authors

Journals

citations
Cited by 53 publications
(17 citation statements)
references
References 130 publications
0
17
0
Order By: Relevance
“…The resolution of e-beam lithography depends on the beam size and several factors related to the electron-solid interaction [24,25]. In a resist, electrons undergo small angle forward scattering and some back-scattering events coming from the substrate.…”
Section: Electron Beam Lithographymentioning
confidence: 99%
“…The resolution of e-beam lithography depends on the beam size and several factors related to the electron-solid interaction [24,25]. In a resist, electrons undergo small angle forward scattering and some back-scattering events coming from the substrate.…”
Section: Electron Beam Lithographymentioning
confidence: 99%
“…Acting in combination, these trends place severe requirements on the mask-writing tool [5]. The high-resolution capability of e-beam writers has been used to advantage throughout the early development of X-ray mask technology with the vector scan generation of tools at the IBM Thomas J. Watson Research Center [6]. Using this capability, a robust process was developed by which X-ray masks could be patterned with high fidelity.…”
Section: Figurementioning
confidence: 99%
“…Both of these factors contribute to an improvement in resolution. However, accurate pattern element deinition in resist, especially at high pattern density, is also limited by the well-known proximity effect [5][6][7]; i.e., adjacent areas not directly exposed to the incident e-beam receive partial exposure from backscattered electrons. The proximity effect is particularly severe for dense patterns with dimensions and spacings of 1 ^m or less.…”
Section: Electron-beam Tool and Process Characteristicsmentioning
confidence: 99%