Nanostructuring expands thermal limits

Kim, Woochul; Wang, Robert Y.; Majumdar, Arun

doi:10.1016/s1748-0132(07)70018-x

Cited by 143 publications

(103 citation statements)

References 65 publications

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“…Nanostructured materials offer unprecedented opportunities for thermal management and energy conversion by enabling a wider range as well as better control of the thermal conductivity [1][2][3][4]. Interfaces are central to their performance since they are scattering centers for heat carriers whose spatial distribution can be set during fabrication and whose dispersion strength can be controlled by tailoring their physical properties [5,6].…”

Section: Introductionmentioning

confidence: 99%

Design rules for interfacial thermal conductance: Building better bridges

Polanco

Rastgarkafshgarkolaei

Zhang

et al. 2017

Phys. Rev. B

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We study the thermal conductance across solid-solid interfaces as the composition of an intermediate matching layer is varied. In absence of phonon-phonon interactions, an added layer can make the interfacial conductance increase or decrease depending on the interplay between (1) an increase in phonon transmission due to better bridging between the contacts, and (2) a decrease in the number of available conduction channels that must conserve their momenta transverse to the interface.When phonon-phonon interactions are included, the added layer is seen to aid conductance when the decrease in resistances at the contact-layer boundaries compensate for the additional layer resistance. For the particular systems explored in this work, the maximum conductance happens when the layer mass is close to the geometric mean of the contact masses. The surprising result, usually associated with coherent antireflection coatings, follows from a monotonic increase in the boundary resistance with the interface mass ratio. This geometric mean condition readily extends to a compositionally graded interfacial layer with an exponentially varying mass that generates the thermal equivalent of a broadband impedance matching network. * cap3fe@virginia.edu † Carlos A. Polanco and Rouzbeh Rastgarkafshgarkolaei contributed equally to this work. ‡ ag7rq@virginia.edu

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Section: Introductionmentioning

confidence: 99%

Design rules for interfacial thermal conductance: Building better bridges

Polanco

Rastgarkafshgarkolaei

Zhang

et al. 2017

Phys. Rev. B

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“…Thermal transport in superlattice metamaterials has attracted significant interest [1][2][3] in recent years due to the ability of superlattice metamaterials to serve as model systems where advanced theoretical concepts of heat conduction [4][5] can be demonstrated and verified. A detailed understanding of the various heat transport mechanisms in superlattices is crucial for designing advanced thermoelectric and thermionic energy conversion devices [6][7] as well as thermal barrier coatings 8 with improved efficiencies.…”

Section: Introductionmentioning

confidence: 99%

Cross-plane thermal conductivity of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices

et al. 2016

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Reduction of cross-plane thermal conductivity and understanding the mechanisms of heat transport in nanostructured metal/semiconductor superlattices are crucial for their potential applications in thermoelectric and thermionic energy conversion devices, thermal management systems, and thermal barrier coatings. We have developed epitaxial (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices with periodicity ranging from 1 nm to 240 nm that show significantly lower thermal conductivity compared to the parent TiN/(Al,Sc)N superlattice system. The (Ti,W)N/(Al,Sc)N superlattices grow with [001] orientation on the MgO(001) substrates with well defined coherent layers and are nominally single crystalline with low densities of extended defects. Cross-plane thermal conductivity (measured by time-domain thermoreflectance (TDTR)) decreases with an increase in the superlattice interface density in a manner that is consistent with incoherent phonon boundary scattering. Thermal conductivity values saturate at 1.7 W/m-K for short superlattice periods possibly due to a delicate balance between long wavelength coherent phonon modes and incoherent phonon scattering from heavy tungsten (W) atomic sites and superlattice interfaces. First-principles density functional theory based calculations are performed to model the vibrational spectrum of the individual component materials and transport models are used to explain the interface thermal conductance (ITC) across the (Ti,W)N/(Al,Sc)N interfaces as a function of periodicity. The long-wavelength coherent phonon modes are expected to play a dominant role in the thermal transport properties of the short-period superlattices. Our analysis of the thermal transport properties of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices addresses fundamental questions about heat transport in multi-layer materials.

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“…This effect is growing in technological importance as characteristic lengthscales of structures and devices continue to get progressively smaller. [1][2][3] For example, interfacial thermal transport at a nanometer scale is important in molecular electronics and conventional integrated circuits, 1,4,5 polymeric composites used in the air-vehicle industry, 6 layered structures for thermal barrier coatings, 7 nanostructured thermoelectric materials, [8][9][10] and could play a role in the eventual development of thermal rectifiers. 11,12 Interface thermal conductance is also important at solid-liquid interfaces for cases including nanoparticle medical therapies, 13,14 evaporation, 15 spray cooling, 16 and electrochemistry.…”

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confidence: 99%

The influence of interface bonding on thermal transport through solid–liquid interfaces

Harikrishna

Ducker

Huxtable

2013

Applied Physics Letters

104

109

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We use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, WSL, for a series of five alkane-thiol monolayers at the gold-water interface. WSL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in WSL, are achieved by varying the terminal group (ω-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60–190 MW m−2 K−1, and the solid-liquid contact angles span from 25° to 118°.

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Nanostructuring expands thermal limits

Cited by 143 publications

References 65 publications

Design rules for interfacial thermal conductance: Building better bridges

Design rules for interfacial thermal conductance: Building better bridges

Cross-plane thermal conductivity of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices

The influence of interface bonding on thermal transport through solid–liquid interfaces

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