Nanowires of Lead-Free Solder Alloy SnCuAg

Abstract

Ternary Sn88Ag5Cu7, Sn93Ag4Cu3, Sn58Ag18Cu24, Sn78Ag16Cu6, Sn90Ag4Cu6, Sn87Ag4Cu9alloy nanowires were produced at various values of deposition potential by dc electrodeposition on highly ordered porous anodic alumina oxide (AAO) templates. During the deposition process some parameters, such as ion content, deposition time, pH, and temperature of the solution, were kept constant. The diameter and length of regular Sn93Ag4Cu3nanowires electrodeposited at −1 V were determined by scanning electron microscopy (SEM) to be approximately 200–250 nm and 7-8 μm, respectively. Differential scanning calorimetry (DSC) results indicate that the melting onset temperature of Sn93Ag4Cu3nanowires is about 204°C.

Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux

“…Up to now, several lead-free nanosolders have been proposed and utilized [11]. The most popular one is tin/silver/ copper (Sn/Ag/Cu) nanoparticles, which can be synthesized through a chemical reduction method [12][13][14] or electrodeposition method [15]. Some other lead-free nanosolder systems include Sn nanosolder particles [16], Sn/Ag alloy nanosolder particles [17,9,18,19] or nanowires [20,21], and Sn-Cu-Bi nanosolder particles [22], etc.…”

Size, Temperature, and Strain‐Rate Dependence on Tensile Mechanical Behaviors of Ni3Sn4 Intermetallic Compound Using Molecular Dynamics Simulation

“…They have become the main developing trend in the microelectronics community. Various eco-and environmentally-friendly Pb-free substitute solder alloys or compositions, such as Sn-rich alloys including Sn-Ag, Sn-Zn, and Sn-Ag-Cu [1][2][3], have been proposed in response to the environmental challenges and needs. Despite the fact that Pb-free solders have been proved to be technologically feasible and shown some very promising advantages, many significant technical issues remain to be dealt with before their wide and successful implementation and application.…”

“…The ultimate tensile strain is the onset point of the necking process. A snapshot of the onset point of the necking phenomenon (i.e., point(3) inFigure 9(a)) is exhibited inFigure 9(b)-(3). Beyond the point, the necking process continues, further decreasing the cross-sectional area of the neck, as can be seen inFigure 9(b)-(4) corresponding to the point (4) in Figure 9(a) (i.e., 11 = 23.0%), and in Figure 9(b)-(5) corresponding to the point (5) in Figure 9(a) (i.e., 11 = 25.0%).…”

Electrochemical Impedance of Sn Nanowire Arrays

“…Electrolytic bath concentration and electrochemical parameters (like deposition potential) were optimized by our previous works [5,6]. Figure 2 shows the SEM images and EDX spectrum of the Sn nanowires electrodeposited in the porous alumina template, after the template was fully etched in 1 M NaOH solution.…”