2006
DOI: 10.1109/ted.2006.873884
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Negative-bias temperature instability cure by process optimization

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Cited by 13 publications
(6 citation statements)
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“…It was reported that thick gate transitors are the most critical devices with respect to NBTI. Thick gate transistors degraded faster than the thin gate transistors during the circuit operation because the thick gate transistor fabrication is with double oxidization and the dual gate oxidation process may not be optimized for stress hardness [10]. As a result, in our paper, the NBTI (bias-temperature) test was mainly studied on 3.3V PMOS transistor with dimensions 9/0.322 and 9/0.376 (um/um, W/L) and the stressed gate voltage is equal to -3.6V and V s /V d /V sub is grounded.…”
Section: Methodsmentioning
confidence: 99%
“…It was reported that thick gate transitors are the most critical devices with respect to NBTI. Thick gate transistors degraded faster than the thin gate transistors during the circuit operation because the thick gate transistor fabrication is with double oxidization and the dual gate oxidation process may not be optimized for stress hardness [10]. As a result, in our paper, the NBTI (bias-temperature) test was mainly studied on 3.3V PMOS transistor with dimensions 9/0.322 and 9/0.376 (um/um, W/L) and the stressed gate voltage is equal to -3.6V and V s /V d /V sub is grounded.…”
Section: Methodsmentioning
confidence: 99%
“…Fluorine incorporated into the gate oxide can improve NBTI. [17][18][19][20][21][22][23][24][25] Fluorine implanted in the polycrystalline silicon (poly-Si) gate and source=drain (S=D) region creates Si-F bonds, which have higher binding energy, at the SiO 2 =Si interface by annealing. [26][27][28][29] These bonds are stable against NBTI stress.…”
Section: Introductionmentioning
confidence: 99%
“…Scarpa et al in [19] suggested several process optimization techniques (e.g. oxide nitridation, adding fluorine to gate oxide etc.)…”
Section: Introductionmentioning
confidence: 99%