1974
DOI: 10.1016/0040-6090(74)90188-6
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Negative resistance and bistable switching in very thin Al2O3 films

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Cited by 4 publications
(4 citation statements)
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“…Owing to the need for high-k and low leakage current materials in DRAM and CMOS, high-k dielectrics of large band gaps (highly insulating) have been intensively investigated. There have been some efforts to detail the nature of resistive switching in such dielectrics including Al 2 O 3 [34,[157][158][159][160][161][162][163], and Gd 2 O 3 [164][165][166] One should therefore confirm the polarity dependence of resistive switching in AAO carefully before drawing the conclusion that unipolar and bipolar switching coexist in this system. (iii) There have been some publications on resistive switching phenomena in Al 2 O 3 films in contact with a Ti electrode, which is oxygen-reactive [160,167].…”
Section: Large Band Gap High-k Dielectric Oxidesmentioning
confidence: 99%
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“…Owing to the need for high-k and low leakage current materials in DRAM and CMOS, high-k dielectrics of large band gaps (highly insulating) have been intensively investigated. There have been some efforts to detail the nature of resistive switching in such dielectrics including Al 2 O 3 [34,[157][158][159][160][161][162][163], and Gd 2 O 3 [164][165][166] One should therefore confirm the polarity dependence of resistive switching in AAO carefully before drawing the conclusion that unipolar and bipolar switching coexist in this system. (iii) There have been some publications on resistive switching phenomena in Al 2 O 3 films in contact with a Ti electrode, which is oxygen-reactive [160,167].…”
Section: Large Band Gap High-k Dielectric Oxidesmentioning
confidence: 99%
“…Mechanisms for resistive switching in Al 2 O 3 have been proposed including the phase transition of Al 2 O 3 due to Joule heat [162], the trapping and detrapping of electronic carriers [162], and the formation and rupture of CFs [163]. Gd 2 O 3 is also a resistive switching material.…”
Section: Large Band Gap High-k Dielectric Oxidesmentioning
confidence: 99%
“…CC-NDR can be caused by different mechanisms, such as impact ionization [1][2][3] and metal-insulator transitions [4][5][6][7], but also by thermally-activated or thermally-assisted mechanisms, such as Schottky emission and Poole-Frenkel conduction [8][9][10]. Although materials systems with CC-NDR have been found since the 60s [11][12][13][14][15][16][17][18], the promise of energy-efficient, neuromorphic hardware to perform in-memory and on-edge processing [19][20][21][22][23][24], has renewed interest and brought about a new wave of research on this phenomenon [4,[25][26][27][28][29]. For instance, selector devices are being implemented in memristor arrays, where the highly non-linear NDR helps to reduce leakage and sneak path currents [30].…”
Section: Introductionmentioning
confidence: 99%
“…Molecule-induced bistable switching of PTJs is of particular interest in molecular electronics since electrically actuated switches are among the most basic components for memory and logic. , At high voltages (on the order of at least 3 V), as prepared rf sputtered and thermally annealed aluminum oxide PTJs , are also known to exhibit switching phenomena; however, these phenomena tend to be associated with uncontrolled junction breakdown, semipermanent phase transitions within the metal−insulator−metal structure, or from filling and emptying of impurity or defect trap states within the oxide film In these junctions, switching and memory phenomena arose from bulk film effects, such as field and/or thermally assisted film restructuring and metal filament formation.…”
Section: Introductionmentioning
confidence: 99%