Neutron Imaging with Timepix Coupled Lithium Indium Diselenide

Abstract

Abstract:The material lithium indium diselenide, a single crystal neutron sensitive semiconductor, has demonstrated its capabilities as a high resolution imaging device. The sensor was prepared with a 55 µm pitch array of gold contacts, designed to couple with the Timepix imaging ASIC. The resulting device was tested at the High Flux Isotope Reactor, demonstrating a response to cold neutrons when enriched in 95% 6 Li. The imaging system performed a series of experiments resulting in a <200 µm resolution limit with the Paul Scherrer Institute (PSI) Siemens star mask and a feature resolution of 34 µm with a knife-edge test. Furthermore, the system was able to resolve the University of Tennessee logo inscribed into a 3D printed 1 cm 3 plastic block. This technology marks the application of high resolution neutron imaging using a direct readout semiconductor.

Perovskite semiconductors for ionizing radiation detection

“…Normally, the as‐grown SC needs to couple with imaging application specific integrated circuit (ASIC) for practical application 104,105 . The coupling process includes pixelated electrode deposition and bonding with the read‐out circuit which involves sophisticated lithography, flip‐chip bonding techniques and so on 106 . Huang et al developed a perovskite SC growth technique which enables direct SC growth on Si wafters which may save the trouble of heterointegration 107 .…”

“…104,105 The coupling process includes pixelated electrode deposition and bonding with the read-out circuit which involves sophisticated lithography, flip-chip bonding techniques and so on. 106 Huang et al developed a perovskite SC growth technique which enables direct SC growth on Si wafters which may save the trouble of heterointegration. 107 A layer of brominated (3-aminopropyl) triethoxysilane was coated on Si water to connect the perovskite and Si through primary chemical bond and enhance the adhesion force (Figure 10D).…”

Detector needs for STS instruments

“…An alternative to the MCP which still uses Timepix chips can be neutron-semiconductor converter coupled to the Timepix using bump bonding [Herrera 2018]. The R&D on this type of detector are still in the early stages, however, several candidate materials exist [Chica 2020, Doan 2015, Maity 2018].…”

Evaluation of Neutron‐Radiation Tolerance of Lithium Indium Diselenide Semiconductors

“…Lithium indium diselenide (LiInSe 2 or LISe) semiconductors have recently demonstrated their ability to be used in neutron imaging, [ 16 ] where a spatial resolution of ≈34 μm was observed, which is dictated by the projected range of the secondary particles in the 6 Li( n , 3 H) 4 He reaction on the readout plane. However, it is unclear what the radiation tolerance of LISe is, which defines its operational lifetime.…”