New Applications of Laser on LED and Semi-Conductor Manufacturing

Abstract

Laser technology has been applied in more and more areas of research. With its fast growth, faster and cheaper solution can be found in different industries. In this paper we present two applications of laser on LED and semi-conductor manufacturing. A new approach facilitated by laser micromachining for improving LED efficiency is introduced first. This is through change of stacking structure and the precision of up-to-date UV 355nm laser technology. The illumination area is increased due to the smaller connecting area (drilling size). Another work is the improving of leakage current of TiO2 film as dielectrics. Through the irradiation of 532nm DPSS laser the refractive index increases and the current leakage is reduced.

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

“…[92] For instance, Lee et al [92] reported the formation of via holes on the sapphire substrate by laser drilling, leading to the efficiency improvement of the UV LEDs by 19% (Figure 6a). Wu et al [93] demonstrated a novel LED device with an n-contact formed at the sapphire backside by depositing n-metals through the laser-drilled micro via holes (as shown in Figure 6b). With this modification, the device becomes surface-mountable and thus facilitates the integration of LED onto the package.…”

“…Wu et al. [ 93 ] demonstrated a novel LED device with an n‐contact formed at the sapphire backside by depositing n‐metals through the laser‐drilled micro via holes (as shown in Figure 6b). With this modification, the device becomes surface‐mountable and thus facilitates the integration of LED onto the package.…”

“…Reproduced with permission. [ 93 ] Copyright 2011, Trans Tech Publications. c) A stretchable 64 × 45 RGB LED display prototype formed by interconnecting electrodes through screen printing isotropic conductive adhesives into laser drilled via holes.…”

“…For comparison, the configuration of a reference LED without via drilling is also included (bottom image). Reproduced with permission [93]. Copyright 2011, Trans Tech Publications.…”