New Electron-Waveguide-Based Modeling for Carbon Nanotube Interconnects

Sarto, Maria Sabrina; Tamburrano, A.; D’Amore, M.

doi:10.1109/tnano.2008.2010253

Cited by 61 publications

(21 citation statements)

References 23 publications

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“…If we take a look on presented in figure 6b, a sma Thus, in this intermediate case on figure 5b, the EM capacit existed for the 3 CNTs but the them (CNT 1 and 3) because o ground plane. So the shift is le because the coupling effects be the first layout (L1), another di is added in order to confirm t visible in figure 6a, a shift frequency is still visible, which From these studies, we demons carbon nanotubes is always w references [11,14]. We also co capacitance existing between changed if other CNTs are modification is directly linked these other CNTs around.…”

Section: Swcnts In Tlmentioning

confidence: 65%

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Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Brun

Franck

Chong³

et al. 2011

2011 IEEE 13th Electronics Packaging Technology Conference

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In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper. IntroductionAfter many years of research on the use of carbon nanotubes (CNTs) for RF applications, every day the state of art becomes closer of industrial constraints. Consequently, the use of CNTs for RF interconnects is now possible and it is now necessary to develop new modeling approach with targeting integration in CAD software. The future of interconnects in RF applications made by conventional materials as copper or gold is promised to meet several difficulties in a nano-scale. Indeed, electromigration phenomena and low current density appear with usual metals when their sizes decrease. The excellent mechanical, electrical and thermal properties of carbon nanotubes permit to avoid this phenomenon [1, 2]. However, not only the study of CNT behavior itself is necessary but his behavior inside a real environment too.In this work, both electromagnetic and circuit models are studied and improved from literature. Coupling existing between CNTs inside and around a bundle is studied. RF structures developed with CNTs are now able to reach a high degree of complexity with the proposed models. Thus, we are able to simulate and implement in device models long singlewall (SWCNTs), multi-walls (MWCNTs) carbon nanotubes, SWCNT and MWCNT bundles.In recent literature [3][4][5][6], number of studies develop CNT bundle models based on the analytical study of carbon nanotubes. Thus, a first approach of CNT bundles behavior is given by all these works, but only a few performed EM simulations in the same time to get the impact of each component. Here is done a fine study of these parameters to simplify the equivalent models of CNT bundles.

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Section: Swcnts In Tlmentioning

confidence: 65%

“…A phonon scattering and defects along the ca supposed negligible [11]. 50 Ω lumped p extremities are considered for highligh resonance of carbon nanotubes and a sm between CNTs and ground plane is used fo coupling effects.…”

Section: Swcnt Models and Validationsmentioning

confidence: 99%

Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Brun

Franck

Chong³

et al. 2011

2011 IEEE 13th Electronics Packaging Technology Conference

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“…Figure 10 shows the crosstalk induced in the active and quiescent lines, and the mutual inductance and the bundle to bundle capacitance have certain effect on the crosstalk between two SWCNT bundle interconnects. On the other hand, we would like to say that skin effect in the CNT bundle interconnect is exclude in our study, since the signal frequency is not above several tens of gigahertz [28]. Otherwise, it should be treated appropriately in the prediction of signal transmission characteristics.…”

Section: Responses Of Cnt Bundlementioning

confidence: 98%

Transfer Function and Compact Distributed RLC Models of Carbon Nanotube Bundle Interconnets and Their Applications

Cui¹,

Wang²

2010

PIER

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Abstract-According to the derived transfer function using different orders of approximation, stability and signal transmission analysis of a driven metallic single-walled carbon nanotube (SWCNT) bundle interconnect are performed. It is shown that as the length of SWCNT bundle interconnect increases, the poles will be closer to the imaginary axis, which causes the transmitted signal response tends to be more damping. Using the fourth-order approximation of the transfer function, the transmitted pulse waveform along the SWCNT bundle interconnect is captured accurately, with signal overshoot and time delay examined. Further, a complete physical model for the transient response of carbon nanotube bundle interconnect is derived, which can also accurately predict the transient response of carbon nanotube bundle interconnect including time delay and crosstalk.

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“…2 considers a quantum capacitance that represents the finite density of states at the Fermi energy and can be expressed as [13,15] , ' that appears between two shells and between external s th shell to ground plane respectively that can be expressed as [13,16] …”

Section: A Multiconductor Tl Modelmentioning

confidence: 99%

Optimized delay and power performances for multi-walled CNT in global VLSI interconnects

Majumder

Das

Kaushik

et al. 2012

2012 5th International Conference on Computers and Devices for Communication (CODEC)

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Multi-walled carbon nanotubes (MWCNTs) with higher number of shells have potentially provided attractive solution in propagation delay and power dissipation. This research paper presents an equivalent single conductor (ESC) model of MWCNT interconnect that is well accurate with any number of shells and distance from the ground plane. Using the ESC model, HSPICE circuit simulations have been performed for different number of shells in MWCNTs. Based on the simulation results, approximate number of shells have been calculated for optimized delay and power performances at global interconnect lengths.

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New Electron-Waveguide-Based Modeling for Carbon Nanotube Interconnects

Cited by 61 publications

References 23 publications

Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Transfer Function and Compact Distributed RLC Models of Carbon Nanotube Bundle Interconnets and Their Applications

Optimized delay and power performances for multi-walled CNT in global VLSI interconnects

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