New fabrication method for micro-pyramidal vertical probe array for probe cards

Abstract

This paper presents a novel, precision process for fabricating a micro metal vertical probe array with various tip angles. The fabrication process includes an inclined and multiple-exposure in ultraviolet (UV) lithographic and Ni electroforming technology. Because of the light passing through an optical transparent homogenous material, the materials' refractive index results in light path deflection. By changing the photomask and workpiece inclination, controllable various tip angles can be fabricated. The experimental results showed that micro metal vertical probes with 54A degrees, 60A degrees and 68A degrees tip angles are achieved. The micro-pyramidal vertical probe array can be used in vertical-type probe cards without the conventional complicated assembly

Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing

“…probe tips, the vertical type, based on the array from standing probe tips vertically [4,5,8,9], and the MEMS type, which forms probe tips by using micromachining technologies [10][11][12][13]. Until now, conventional cantilever-type probe cards have frequently been used, which are fabricated manually.…”

“…Vertical probe cards are more advantageous in tests of semiconductor devices with areaarray pads, and more convenient for the repair of probe pins. But, large pitches between the probe tips make these cards unsuitable for the tests involving applications to various semiconductor devices [4,5]. However, MEMS probe cards can be fabricated using variously shaped probes, which are made by MEMS process.…”

“…The probe card is increasingly of more and more importance [1][2][3]. As memories show increasingly higher levels of performance, and system large scale integrated circuit (LSI) devices offer increasingly higher densities, the sizes of semiconductor devices are relatively decreasing, resulting in reduced pad sizes, and fine pitches between pads [4,5]. Therefore, test systems to judge whether integrated circuit (IC) chips on a wafer are nondefective or defective also need to be developed rapidly, in line with semiconductor development technologies.…”

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

“…In addition, it is an important factor for determining the mass production quantity of semiconductor devices. Recently, the pad area and pitch of the devices have been decreasing as memory devices are highly integrated (Hauck et al 2010;Lin et al 2010;Mair and Armendariz 2011;Marinissen et al 2011). MEMS probe cards applying micromachining technologies and electrolytic plating techniques have the advantages of mass production and lower manufacturing costs (Wang et al 2008;Kim and Kim 2008;Marinissen et al 2011).…”

“…Probe cards are classified as horizontal (Kim et al 2007;Park et al 2002) and vertical (Hauck et al 2010;Lin et al 2010;Jim 2011;Lee and Sadrabadi 2011;Armendariz and Tong 2011) according to the probe arrangement method. A horizontal probe card is restricted to the device types with the pads of lead on center (LOC) or lead on top edge (LOTE), because the procedure of fabrication remains manual and the probe is long.…”