New facts from lead-free solders reliability investigation

Szendiuch, Ivan; Jankovsky, J.; Bursik, Martin; Hejatkova, Edita

doi:10.1109/estc.2010.5642801

Cited by 2 publications

(2 citation statements)

References 3 publications

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Section: Introductionmentioning

confidence: 99%

“…Some scholars claim that the thermal and soldering time could have a significant effect on the solder joint shear strength (Kim et al , 2008; Szendiuch et al , 2010; Hu et al , 2014, 2017; Choudhury and Ladani, 2016; Lee et al , 2017). The focus of the study by Szendiuch et al (2010) was on the solder joints after the thermal cycling effect. It pointed out that the cyclic exposure of the solder interconnection to temperature deteriorates solder joint strength partly due to the growth of the intermetallic layer after the thermal cycling.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical reliability of self-aligned chip assembly after reflow soldering process

Mokhtar

Abdullah

Saad

et al. 2020

SSMT

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Purpose This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the self-alignment assemblies of SnAg alloy solder joints with varying silver content. Design/methodology/approach The shear strength assessment was conducted in accordance with the JIS Z3 198-7 standard. The standard visual inspection of IPC-A-610G was also performed to inspect the self-alignment features of the solder joint samples. Statistical analysis was conducted to determine the probabilistic relationship of shear strength of the misalignment components. Findings The results from the mechanical reliability study indicate that there were decreasing trends in the shear strength value as misalignment offset increased. For shift mode configuration in the range of 0-300 µm, the resulting chip assembly inspection after the reflow process was in line with the IPC-A-610G standard. The statistical analysis shows that the solder type variation was insignificant to the shear strength of the chip resistor. The study concluded that the fracture occurred partially in the termination metallization at the lower part of the chip resistor. The copper content of the joint on that area shows that the crack occurred in the solder joint, and high silver content on the selected zone indicated that the fracture happened partially in the termination structure, as the termination structure of the lead-free chip resistor consists of an inner layer of silver and an outer layer of tin. Practical implications This study’s findings provide valuable guidelines and references to engineers and integrated circuit designers during the reflow soldering process in the microelectronics industry. Originality/value Studies on the effect of component misalignment on joint mechanical reliability are still limited, and studies on solder joint reliability involving the effect of differing contents of silver on varying chip component offset are rarely reported. Thus, this study is important to effectively bridge the research gap and yield appropriate guidelines in the potential industry.

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