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This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.

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The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were usedprinting and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.