Usage of LTCC technology in electronic packaging

Psota, Boleslav; Klíma, Martin; Nicak, Michal; Szendiuch, Ivan

doi:10.1109/isse.2013.6648243

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2014

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“…Because of demanding fabrication of sample for structure edge hermeticity measurement, article will deal with hermeticity of sheets plane only. To reach good hermeticity, high quality of lamination and via fabrication is required [4].…”

Section: Introductionmentioning

confidence: 99%

Usage of low-temperature co-fired ceramic in hermetic packaging

Klíma

Somer

Blahová

et al. 2014

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured -Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

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Section: Introductionmentioning

confidence: 99%