This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

2014),"Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing", Soldering & Surface Mount Technology, Vol. 26 Iss 4 pp. 173-179 http://dx.(2014),"Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering", Soldering & Surface Mount Technology, Vol. 26 Iss 4 pp. 214-222 http://dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components. Design/methodology/approach -The authors discuss the characteristics of the design, the threshold temperatures, dynamic properties of the system and, most importantly, the reliability and the useful life of the Peltier elements. The advantages and disadvantages of the system are mentioned as well as examples of use. Findings -The utilisation of Peltier elements for temperature cycling is possible, but it is important to keep in mind that the reliability of the elements is similar to the reliability of the system, and therefore, it is essential to replace the defective Peltier elements during the cycling.Research limitations/implications -The construction of system is very simply. It is necessary to ensure the Peltier elements with low dispersion parameters. Originality/value -The system is very well suited for cycling of printed boards, especially one sided, multi-chip systems, COB systems, flip-chip embedded construction, etc. The system can be used in situations where it is possible to ensure an effective heat transfer and where extremely low temperatures are not required.

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