2005
DOI: 10.1016/j.jeurceramsoc.2005.03.064
|View full text |Cite
|
Sign up to set email alerts
|

New LTCC-hexaferrites by using reaction bonded glass ceramics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
13
0

Year Published

2006
2006
2022
2022

Publication Types

Select...
4
2
1

Relationship

0
7

Authors

Journals

citations
Cited by 21 publications
(13 citation statements)
references
References 5 publications
0
13
0
Order By: Relevance
“…The choice of filler depends on the dielectric demands of the microelectronic device. The most commonly used filler is alumina, 3 but mullite, 3 cordierite, 4 barium titanate, and ferrites 5 are also applied to achieve specific properties. Because none of these pure, undoped filler materials can be densified at temperatures around 900°C, the composites contain a low softening glass, which is responsible for sufficient densification.…”
Section: Introductionmentioning
confidence: 99%
See 2 more Smart Citations
“…The choice of filler depends on the dielectric demands of the microelectronic device. The most commonly used filler is alumina, 3 but mullite, 3 cordierite, 4 barium titanate, and ferrites 5 are also applied to achieve specific properties. Because none of these pure, undoped filler materials can be densified at temperatures around 900°C, the composites contain a low softening glass, which is responsible for sufficient densification.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the glass phase is partially crystallized during firing to improve the properties and shape stability. In the last few years, attempts have been made to densify LTCC materials that possess a low glass content <10 vol% in order to take maximum advantage of the physical properties of the ceramic filler component and to reduce the losses in the GHz range 5,9,10 …”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Because of high sintering temperature above 1200°C, the conventional M-type hexaferrites cannot co-fire with the inner electrode metal Ag with melting point of 961°C in LTCC systems. Interestingly, the sintering temperature of these ferrites can be reduced to 900°C by using some glass phase or metallic oxide as sintering aids, but their magnetic properties decrease accordingly [6][7][8][9]. How to improve their low temperature sintering characteristics is significant for the miniaturization and integration of new microwave LTCC modules.…”
Section: Introductionmentioning
confidence: 99%
“…Sintering additives like various glasses are used to reduce the sintering temperature to below the melting point of Ag, a major constituent of common metallization pastes. Ba hexaferrites were recently adapted to LTCC for microwave applications [6,7] but NiCuZn ferrites have found even more interest due to their good processability and performance up to several 10 MHz. Relative permeabilities of up to 400 and inductances of several 100 μH were reported [8].…”
Section: Introductionmentioning
confidence: 99%