32nd European Solid-State Device Research Conference 2002
DOI: 10.1109/essderc.2002.194981
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New Mechanism of Body Charging in Partially Depleted SOI-MOSFETs with Ultra-thin Gate Oxides

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Cited by 73 publications
(59 citation statements)
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“…The figure also clearly shows a hysteresis in the curve, caused by transient effect. The majority carriers introduced in the silicon film by EVB tunneling also have a pronounced impact on the drain current transients observed when the drain current is switched from a high to a low front gate voltage [16][17]. This is illustrated in Fig.…”
Section: Soi Technologiesmentioning
confidence: 80%
“…The figure also clearly shows a hysteresis in the curve, caused by transient effect. The majority carriers introduced in the silicon film by EVB tunneling also have a pronounced impact on the drain current transients observed when the drain current is switched from a high to a low front gate voltage [16][17]. This is illustrated in Fig.…”
Section: Soi Technologiesmentioning
confidence: 80%
“…The positive charges trapped in the field oxide and buried oxide are not sufficient enough to produce an inversion layer, so that there is no radiation-induced leakage and threshold voltage shift to be observed. Before irradiation, a second hump in the transconductance characteristic is noticeable close to V g =1.2-1.3V, and the value of the second transconductance g m peak exceeds the normal peak due to the electron-valence-band (EVB) tunneling [5]. The electrons in the body region can tunnel from the valence band across the gate dielectric to the ploysilicon under a sufficient vertical electric field, when the gate oxide thickness is less than 2 nm [13].…”
Section: Resultsmentioning
confidence: 99%
“…Meanwhile, there is no change in the gate current before and after irradiation, as shown in Fig.2. The attenuation of the second g m peak implies that fewer holes are stored in the body of SOI MOSFETs after irradiation [5]. There are two possibilities for the decline of the second g m peak: (1) the EVB tunneling is suppressed after irradiation, with fewer holes generated in the floating body, because more traps generated in the gate oxide and interface between the gate oxide and the silicon; (2) the excess holes remove more quickly from the body after radiation so that there are less excess holes stored in the body region.…”
Section: Resultsmentioning
confidence: 99%
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“…O caso inverso ocorre quando a porta varia da inversão fraca para inversão forte ("off" para "on"), neste caso as lacunas se recombinam para aumentar a região de depleção e atingir um maior valor da tensão de limiar correspondente a condição de equilíbrio. Dispositivos com reduzidas espessuras de óxido de porta estão sujeitos a outro FBE, que está associado com o tunelamento direto através do óxido de porta 51,97 Por fim, foi estudado neste trabalho o efeito de corpo flutuante com a variação da geometria em dispositivos FinFET de porta tripla, com e sem a região de implantação de HALO. Em dispositivos mais estreitos observa-se uma redução na transcondutância máxima e uma redução na amplitude do segundo pico da transcondutância.…”
Section: Galeti M; Martino J A; Simoen E; Claeys C; Impact Ounclassified