New triepoxy monomer and composites for thermal and corrosion management

Abstract

The denser and faster componented next‐generation electronic devices produce an increased amount of heat during operations. Thermal dissipation is critical to the performance, lifetime, and reliability of electronic devices. With emerging of new applications such as three‐dimensional chip stack architectures, flexible electronics, and light‐emitting diodes, thermal dissipation becomes a challenging problem. In this study, a new resole‐based epoxy monomer is designed. The novelty of the monomer is triepoxy functional soth upon curing (polymerization) the crosslink density is more. Composites of this epoxy with graphene functionalized with amine have been synthesized and characterized by thermal and mechanical methods. The thermal conductivity is increased to 0.6 W/mK by using graphene amine (12 wt%), which suggests that the composites can be useful for encapsulations. The composites are also useful as a coating material for corrosion protection on mild steel (MS). The electrochemical polarization studies on coated specimens showed that the composites are excellent coatings, which exhibited a very low corrosion rate of the order of 10−3–10−4 mm/year.

Design, synthesis, and evaluation of high‐performing anticorrosive polyurethane coatings with inbuilt redoxable oligomeric aniline segments

“…Electrochemical impedance spectroscopy (EIS) is the eminent test for the investigation of corrosion resistance of thin films and various types of coatings. In this study, films are characterized by frequency domain in a wide range from 10 5 to10 −2 Hz and the resultant data are fitted with the respective circuit which has elements such as polarization resistance conductance and capacitance 68–70 . The anti‐corrosive behavior of EPUU coatings was characterized by electrochemical impedance spectroscopy in the frequency domain including Nyquist and bode plots in a 3.5% sodium chloride solution.…”

“…In this study, films are characterized by frequency domain in a wide range from 10 5 to10 À2 Hz and the resultant data are fitted with the respective circuit which has elements such as polarization resistance conductance and capacitance. [68][69][70] The anti-corrosive behavior of EPUU coatings was characterized by electrochemical impedance spectroscopy in the frequency domain including Nyquist and bode plots in a 3.5% sodium chloride solution. However, all the samples were tested after 45 h of immersion in the salt solution for 25 wt% and 30 h of immersion for 12.5 wt% due to the initial coating was highly resistive to make electron transfer across to the surface of the steel.…”

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

“…Figure 4 shows the temperature and thermal stress after adding underfill. The maximum temperature was reduced to 399.16 K. Clearly, the underfill plays a significant role in heat dissipating and supporting [ 18 , 19 , 20 , 21 ]. In contrast to Figure 3 , we known that the reliability of the FCP was worse compared to the Ag sintered package.…”

Accurate self‐damage detection by electrically conductive epoxy/graphene nanocomposite film

“…Given the high demand in multifunctional polymeric materials, an epoxy/graphene nanocomposite film was reported as a corrosion-resistant coating layer [51][52][53][54] where weather changes and environment conditions are severe. In the current work, we propose a facile approach to detect and identify damage location using epoxy/ graphene platelet nanocomposite films; these films have the potential to work as a conductive coating layer.…”