Newly developed ultra thin fan-out wafer level package for PoP usage

Shimamoto, H.; Soga, Kenichi; Takemra, K.; Yanagisawa, Hirotaka; Asai, S.; Kondo, K.; Sugo, Michihiro; Kato, Hideto; Matsuda, Youichi

doi:10.1109/icep.2014.6826655

2014 International Conference on Electronics Packaging (ICEP) 2014

DOI: 10.1109/icep.2014.6826655

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Newly developed ultra thin fan-out wafer level package for PoP usage

H. Shimamoto¹,

Kenichi Soga

K. Takemra

et al.

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Newly developed ultra thin fan-out wafer level package for PoP usage

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