Ni–P electroless deposition directly induced by sodium borohydride at interconnected pores of poly (ether ether ketone)/multiwalled carbon nanotubes composites surface

Zhai, T.; Liu, Bin; Ding, Chunhui; Lu, Lixia; Zhang, Chi; Xue, Kun-Guang; Yang, De’an

doi:10.1016/j.surfcoat.2015.04.012

Cited by 27 publications

(5 citation statements)

References 35 publications

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“…Some transition metals with catalytic properties, such as palladium (Pd) and nickel (Ni), are effective in stimulating and driving the electroless plating reaction mechanism due to their superior catalytic reactivity towards sodium hypophosphite. [35][36][37] While other metals such as Zn, Fe, and Al do not have catalytic activity themselves, 38,39 they can act as catalytically active centers by reducing Ni 2+ to nickel metal. Previously, it was assumed that copper could not initiate the electroless plating process.…”

Section: Chemical Compositionmentioning

confidence: 99%

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

Zhu,

Wang,

Sun

et al. 2024

J. Electrochem. Soc.

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Electroless plating is a commonly used method to enhance the corrosion resistance, wear resistance, and decorative performance of aluminum alloys. However, in electroless plating processes, it is customary to maintain the solution temperature at levels exceeding 85°C, a critical condition that ensures a sufficiently rapid deposition rate and thereby fosters the formation of high-performance coatings. Conventional immersion pretreatments with zinc and palladium result in lower deposition rates at low temperatures. This study shows that a copper immersion layer with microporous channels can facilitate the electroless plating process for aluminum alloys at lower temperatures. Through a redox reaction in a Cu2+-containing solution at 70°C, a copper immersion layer with a microporous structure could be created on an aluminum alloy. The microporous channels between the copper immersion layer and the aluminum alloy create electrochemical corrosion cells in the plating solution, accelerating the electroless plating process. The Ni-P coating obtained after pretreatment by copper immersion has a higher hardness (578 HV) and a lower corrosion current density (0.55 μA/cm2). This work provides a practical method to rapidly fabricate high-performance Ni-P coatings at intermediate temperatures (70-75°C).

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Section: Chemical Compositionmentioning

confidence: 99%

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

Zhu,

Wang,

Sun

et al. 2024

J. Electrochem. Soc.

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“…In ternary alloys, an additional element is added to the binary alloys to create a composite or an alloy coating. Literature review suggests that binary coatings like Ni-P and Ni-B has proved to have better tribological and mechanical properties [14][15][16][17][18]. However, the need of having better properties is always a demand in this era and challenging to the researchers at the same time.…”

Section: Introductionmentioning

confidence: 99%

Optimization of process parameters for electroless Ni–Co–P coating deposition to maximize micro-hardness

Sarkar

Baranwal

Biswas

et al. 2019

Mater. Res. Express

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The present study investigates optimisation of microhardness of electroless Ni-Co-P alloy coating over copper substrate. The microhardness of the coating was significantly higher compared to the substrate. Three different design factors i.e., the concentration of cobalt sulphate, concentration of sodium hypophosphite and bath temperatures were used as the process parameters which were optimised by using Box Behnken Design (BBD) and coating micro hardness was taken as a response factor. Vickers' hardness test was conducted to obtain the micro hardness values of the coated samples. From the model analysis results, it was found 15 g/L of cobalt sulphate, 25 g/L of sodium hypophosphite and a bath temperature of 85 °C were the optimum conditions for the coating deposition in order to obtain the hardness value of 1921 HV10g. After annealing at 350 °C the hardness value was further enhanced to 1990 HV10g. Analysis of variance (ANOVA) was carried out to find the graphical relationship between the different process parameters. The detail surface morphology of the Ni-Co-P coating was studied by using an optical microscope and a Scanning Electron Microscope (SEM). The phase and elemental compositions were determined by X-Ray Diffraction (XRD) analysis and Energy Dispersive X-Ray analysis (EDX).

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“…Electroless plating is one of the most popular technology, which has been widely used as an effective way for surface-modification of CNTs because that it is much simpler, lower cost and without vacuum or high temperature. 1-6 The metallic ions change into metal and deposit on the substrate surface to form surface modified coating through the chemical reduction. 7-9 At present, most research activities have been focused on electroless Ni, Fe and alloy plating on CNTs, 10-14 and only limited research has been concerned with plating Co and Co–P alloy.…”

Section: Introductionmentioning

confidence: 99%

Continuous Co–P coating on CNTs by optimising electrodeposition

Shi

et al. 2017

Surface Engineering

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Continuous Co 2 P nanoparticles were deposited on the surfaces of carbon nanotubes (CNTs) with the thickness of 7-10 nm by electroless plating. Effects of pH, temperature and plating time on the coating were discussed and the optimised processing parameters were obtained. The morphologies and components of Co 2 P-CNTs nanocomposites were analysed by TEM and energy dispersive spectroscope. The results indicated that Co 2 P nanoparticles were deposited on multi-walled carbon nanotubes homogeneously at the temperature of 45°C, pH of 4.9 and plating time of 30 min. The saturation magnetisation of uniform Co 2 P-CNTs nanocomposites was 2.81 emu g -1 and the coercivity was as high as 1285.2 Oe. Compared to those of the bulk cobalt, the coercivity of Co 2 P-CNTs nanocomposites was enhanced while the saturation magnetisation decreased.

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Ni–P electroless deposition directly induced by sodium borohydride at interconnected pores of poly (ether ether ketone)/multiwalled carbon nanotubes composites surface

Cited by 27 publications

References 35 publications

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

Optimization of process parameters for electroless Ni–Co–P coating deposition to maximize micro-hardness

Continuous Co–P coating on CNTs by optimising electrodeposition

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