2018
DOI: 10.1007/s00339-018-1861-5
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Nickel electroplating on copper pre-activated Al alloy in the electrolyte containing PEG1000 as an additive

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Cited by 5 publications
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“…Diameters of these colloids were approximately 25 to 100 Å. After sensitization, the surface was metallized with palladium (Pd) by oxidizing normalSn2+ to normalSn4+ and reducing normalPd2+ ions to Pd atoms using an activation solution since Ni tools have superior properties such as resistance to corrosion and minor scratches [2226]. Additionally, Ni tools may be fabricated with micrometer level sensitivity and very low residual stresses via electroforming [14, 2733].…”
Section: Introductionmentioning
confidence: 99%
“…Diameters of these colloids were approximately 25 to 100 Å. After sensitization, the surface was metallized with palladium (Pd) by oxidizing normalSn2+ to normalSn4+ and reducing normalPd2+ ions to Pd atoms using an activation solution since Ni tools have superior properties such as resistance to corrosion and minor scratches [2226]. Additionally, Ni tools may be fabricated with micrometer level sensitivity and very low residual stresses via electroforming [14, 2733].…”
Section: Introductionmentioning
confidence: 99%