2016
DOI: 10.1063/1.4960532
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Noise performance of high-efficiency germanium quantum dot photodetectors

Abstract: We report on the noise analysis of high performance germanium quantum dot (Ge QD) photodetectors with responsivity up to $2 A/W and internal quantum efficiency up to $400%, over the 400-1100 nm wavelength range and at a reverse bias of À10 V. Photolithography was performed to define variable active-area devices that show suppressed dark current, leading to a higher signal-to-noise ratio, up to 10 5 , and specific detectivity D Ã ' 6 Â 10 12 cm Hz 1=2 W À1. These figures of merit suggest Ge QDs as a promising a… Show more

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Cited by 16 publications
(20 citation statements)
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“…The photodetectors were fabricated by co‐sputtering of Ge and SiO 2 targets on p − (5–10 Ω cm) Si substrates held at a temperature of 400 °C yielding a 200 nm‐thick oxide matrix with embedded Ge QDs . Following deposition the samples were annealed at 500 °C in a N 2 environment for 30 min to generate larger size and higher density Ge QDs with improved crystalline quality . Subsequently, an optically transparent, highly‐conductive ∼100 nm‐thick indium tin oxide (ITO) layer was sputter‐deposited as the top electrode.…”
Section: Fabrication Processmentioning
confidence: 66%
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“…The photodetectors were fabricated by co‐sputtering of Ge and SiO 2 targets on p − (5–10 Ω cm) Si substrates held at a temperature of 400 °C yielding a 200 nm‐thick oxide matrix with embedded Ge QDs . Following deposition the samples were annealed at 500 °C in a N 2 environment for 30 min to generate larger size and higher density Ge QDs with improved crystalline quality . Subsequently, an optically transparent, highly‐conductive ∼100 nm‐thick indium tin oxide (ITO) layer was sputter‐deposited as the top electrode.…”
Section: Fabrication Processmentioning
confidence: 66%
“…Subsequently, an optically transparent, highly‐conductive ∼100 nm‐thick indium tin oxide (ITO) layer was sputter‐deposited as the top electrode. Photolithography was then performed to define several 1 mm 2 active area devices, obtained by etching away the ITO and Ge QD/SiO 2 layers using a dilute HF solution, with the aim of suppressing leakage current on the periphery as described in our previous work . Subsequently, an indium back contact was used to attach the detector onto a 0.5 mm thick sapphire (Al 2 O 3 ) substrate.…”
Section: Fabrication Processmentioning
confidence: 66%
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“…[3][4][5] In the former case, the QDs can become charged by tunneling of electrons or holes from the silicon substrate through a tunnel oxide. Successful operation requires that the charge does not leak away by the assistance of traps or defects in the material stack or by thermally-assisted tunneling to the substrate.…”
mentioning
confidence: 99%