Non-contact batch micro-assembly by centrifugal force

Lai, King Wai Chiu; Hui, Allan P.; Li, W.J.

doi:10.1109/memsys.2002.984235

Cited by 18 publications

(8 citation statements)

References 4 publications

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“…Lai et al assembled 3D microstructures fabricated by a multi-user MEMS process by means of centrifugal forces [20]. They devised an experimental set-up which could provide steady angular velocity to the substrates and reduce the effects of airflow.…”

Section: Self-assembly Of Microelectromechanical Structuresmentioning

confidence: 99%

Self-assembly from milli- to nanoscales: methods and applications

Mastrangeli

Abbasi

Varel

et al. 2009

J. Micromech. Microeng.

230

202

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The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed.

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Section: Self-assembly Of Microelectromechanical Structuresmentioning

confidence: 99%

Self-assembly from milli- to nanoscales: methods and applications

Mastrangeli

Abbasi

Varel

et al. 2009

J. Micromech. Microeng.

230

202

View full text Add to dashboard Cite

show abstract

“…The mechanical frequency component 2ω 0 also occurs because the sinusoidal signal k 2 produces an alternate centrifugal force [3]. 6), (7), and (12), the speed command ω * r equals k 1 + k 2 sin ω 0 t. For the spectrum in Fig. 10, the speed frequency ω * r and the minor vibration frequency ω 0 are specified as 48 and 10 Hz, respectively.…”

Section: Modementioning

confidence: 99%

“…The vibration motor can provide the required vibration operations, such as sifting, mixing, filtering, conveying, and centrifugal. However, the conventional approach [6,7] is always regulated to produce the centrifugal force by manually adjusting the angle of the blade on the rotor side. Also, the screw has to be firmly tightened to prevent the hazardous ejection of the vibrating blades.…”

Section: Introductionmentioning

confidence: 99%

Investigation of flexible multi-mode harmonic vibration for the automatic washing process

Kuo

Wang²

2008

Proceedings of the Institution of Mechanical Engineers, Part C:

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This article discusses multi-mode vibration for the vibration motor in the washing process. Sinusoidal vibration modes for the speed servo command are carefully designed for flexible control. Different kinds of operating modes for possible automatic process control are provided. Three basic and five extended vibration modes for different operations are proposed. Simulation and experimental results will be compared to verify the formulation. To make the washing process more flexible, various servo commands are provided to be reconfigurable for the required vibration motion. Differing from the conventional approach of mechanically regulating the blade angle of the vibration motor, multi-mode vibration developed by the software approach is successfully proposed. It is easier for the washing process to be electrically regulated instead of it being a mechanical operation only. It is believed that this article will be beneficial for the application of an automatic washing process of the washing machine.

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“…Various automated microassembly mechanisms have been developed which include (1) centrifugal force, 9,10 (2) magnetic force, 11 (3) external electrostatic force, 12,13 (4) themokinectic, 14 (5) residual stress, 15,16 (6) liquid flow and chemical, [17][18][19] (7) template, 20 and (8) on-chip microactuator-based [21][22][23][24] assembly technologies. Among those automated microassembly technologies, the on-chip microactuator assembly is very promising for several reasons.…”

Section: Introductionmentioning

confidence: 99%

Novel automated microassembly mechanism based on on-chip actuators

He¹

2013

J. Micro/Nanolith. MEMS MOEMS

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The development of a novel automated microassembly mechanism based on on-chip actuators is described. The assembly mechanism utilizes repulsive-force actuators to flip surface-micromachined twodimensional structures out-of-plane and assemble them in a vertical position. The assembly mechanism is suitable for wafer-level multidevice batch assembly without external interference. Prototypes were fabricated using the PolyMUMPs surface micromachining technology, then tested. The strength of the assembled structures in terms of withstanding external acceleration was calculated and experimentally measured. The measured results showed the assembly strength of 7 g for prototype 1 and 8 to 11 g for prototype 2.

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Non-contact batch micro-assembly by centrifugal force

Cited by 18 publications

References 4 publications

Self-assembly from milli- to nanoscales: methods and applications

Self-assembly from milli- to nanoscales: methods and applications

Investigation of flexible multi-mode harmonic vibration for the automatic washing process

Novel automated microassembly mechanism based on on-chip actuators

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