Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Zhao, Hongyun; Liu, J.H.; Li, Z.L.; Zhao, Yixuan; Niu, Haiyue; Song, Xiaoguo; Dong, H.J.

doi:10.1016/j.matlet.2016.10.017

Cited by 56 publications

(13 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These traits make the use of ultrasonic power greatly desired in the field of soldering as well as in the electronics industry. The suitability of this technology has been successfully documented by many scientific studies in the fields of brazing, soldering [1][2][3][4] and transient liquid phase (TLP) bonding [5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Koleňák

Kostolný

Drápala³

et al. 2018

Metals

View full text Add to dashboard Cite

The aim of the research was to characterize the soldering alloy In-Ag-Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 • C. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti 3 In 4) and silver (AgIn 2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide-SiTi and titanium carbide-C 5 Ti 8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase-(CuAg) 6 In 5 and (AgCu)In 2. The average shear strength of a combined joint of SiC-Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In-Ag-Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

show abstract

Section: Introductionmentioning

confidence: 99%

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Koleňák

Kostolný

Drápala³

et al. 2018

Metals

View full text Add to dashboard Cite

show abstract

“…Comparing the simulations with experiments[28] in terms of the kinetics of evolution and obtained morphology. TLPB experimental results at 250 • C after a) 20 b) 40 and c) 60 minutes.…”

mentioning

confidence: 99%

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

et al. 2018

View full text Add to dashboard Cite

In this work, we integrate different computational tools based on multi-phase-field simulations to account for the evolution of morphologies and crystallographic defects of Cu/Sn/Cu sandwich interconnect structures that are widely used in three dimensional integrated circuits (3DICs). Specifically, this work accounts for diffusion-driven formation and disappearance of multiple intermetallic phases during accelerated electromigration and takes into account the non-equilibrium formation of vacancies due to electromigration. The work compares nucleation, growth, and coalescence of intermetallic layers during transient liquid phase bonding and virtual joint structure evolution subjected to accelerated electromigration conditions at different temperatures. The changes in the rate of dissolution of Cu from intermetallics and the differences in the evolution of intermetallic layers depending on whether they act as cathodes or anodes are accounted for and are compared favorably with experiments. The model considers non-equilibrium evolution of vacancies that form due to differences in couplings between diffusing atoms and electron flows. This work is significant as the point defect evolution in 3DIC solder joints during electromigration has deep implications to the formation and coalescence of voids that ultimately compromise the structural and functional integrity of the joints.

show abstract

“…Most widely used meting point depressants are pure C, B, or phosphorus as an interstitial element to reduce the isothermal solidification time [35,64,68]. Notable reduction in TLP bonding time has been obtained, to yield a very short 10 to 15 min, which covers the entire isothermal solidification and composition homogenization duration [35,[52][53][54][55][56][57][58][59][60][61][62][63][64]. More recently, the use of Sn coated Cu powders or Sn-Cu coated carbon nanotubes has been documented in past research.…”

Section: Bonding Timementioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

View full text Add to dashboard Cite

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

show abstract

Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Cited by 56 publications

References 11 publications

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Contact Info

Product

Resources

About