Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging

Kumaresan, Vigneshwarram; Sreekantan, Srimala; Devarajan, Mutharasu; Mohamed, Khairudin

doi:10.1080/00218464.2020.1860765

Cited by 4 publications

(1 citation statement)

References 33 publications

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“…Another method is to add high-thermal-conductivity fillers into the polymers. The fillers are usually mixtures of ceramic powders [ 8 , 9 , 10 ], metal powders [ 11 , 12 , 13 ], or even diamond powders [ 14 , 15 ]. Practically, the TC of polyethylene (PE, [–CH 2 –CH 2 –] n ) fibers and films can achieve 104 W/(m·K) [ 16 ] and 62 W/(m·K) [ 17 ], respectively, which is the highest among the pure polymers because of its simple C–C bond.…”

Section: Introductionmentioning

confidence: 99%

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Wu,

Chen,

Jiang

et al. 2024

Polymers

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The escalating thermal power density in electronic devices necessitates advanced thermal management technologies. Polymer-based materials, prized for their electrical insulation, flexibility, light weight, and strength, are extensively used in this field. However, the inherent low thermal conductivity of polymers requires enhancement for effective heat dissipation. This work proposes a novel paradigm, emphasizing ordered structures with functional units, to create triple-level, ordered, low-filler loading of multi-walled carbon nanotube (MWCNT)/poly(vinyl alcohol)(PVA) nanofibrous films. By addressing interfacial thermal resistance through –OH groups, the coupling between polymer and MWCNT is strengthened. The triple-level ordered structure comprises aligned PVA chains, aligned MWCNTs, and aligned MWCNT/PVA composite fibers. Focusing on the filler’s impact on thermal conductivity and chain orientation, the thermal transport mechanisms have been elucidated level by level. Our MWCNT/PVA composite, with lower filler loadings (10 wt.%), achieves a remarkable TC exceeding 35.4 W/(m·K), surpassing other PVA composites with filler loading below 50 wt.%.

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Section: Introductionmentioning

confidence: 99%

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Wu,

Chen,

Jiang

et al. 2024

Polymers

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Self‐healing, low oil leakage and recyclable thermally conductive Al₂O₃/boron nitride@siloxane composites based on reversible dynamic network

Tu,

Wu,

Hao

et al. 2024

J of Applied Polymer Sci

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In order to overcome the commercialized silicone‐based thermal interface materials' issues such as oil leakage and mechanical damage, we developed a thermoset silicone rubber matrix (SR) achieved through the condensation reaction of hydroxyl silicone oil and tetraethyl silicate. Additionally, we constructed a self‐healing and recyclable silicone rubber matrix (SCNR) by incorporating heat reversible ionic and hydrogen bonds between carboxyl and amino functionalized polydimethylsiloxane. Finally, the flexible, low oil leakage, self‐healing, and recyclable composites Al2O3/BN@SR/SCNR was prepared by adjusting the ratio of SR/SCNR and the spherical alumina and boron nitride (BN) fillers. The results indicated that with SR/SCNR mass ratio of 1/0.075 and filler content of 70 wt%, the thermal conductivity of the composite reaches 1.866 W m−1 K−1, 646% increasing over the SR/SCNR matrix. The self‐healing efficiency reaches 97% and the thermal conductivity remains essentially unchanged after being recycled for three times. The composites can be bent and twisted multiple times and still return to their original shape. Notably, the oil leakage of the Al2O3/BN@SR/SCNR composites is significantly lower than that of additive silicone composites. Therefore, the recyclable thermal conductivity composite developed in this study provides a promising solution for improving the durability of heat dissipation materials in electronic devices.

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Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate

Lyu,

Sun,

Ouyang

et al. 2024

Journal of Applied Physics

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Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity of the sintered ceramic substrate. Researchers have attempted to minimize ceramic porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade thermal conductivity or quality of substrate evenness. This study proposes a low-cost casting-warm pressing process to densify pure alumina ceramic substrates using micro–nano-mixed alumina powders and sintering at relatively low temperatures. The results indicate that the relative density of the pure alumina ceramic substrate prepared at 1500 °C is 93%, a 4.4% improvement over the tape casting process. Additionally, the thermal conductivity of the alumina substrate from the casting-warm pressing process reaches 15.89 W/(m K), which is 1.4 times higher than that of the tape casting process. Microstructure analysis shows that the casting-warm pressing process with micro- and nano-multi-scale mixed alumina powders forms a novel thermal conduction enhancement mechanism. Large particles in the green tape overlap, while small particles fill the spaces between the large particles. The connected micrometer-sized particle skeletons form high thermal conduction net channels in the substrate, improving the thermal conductivity for heat transfer.

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Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging

Cited by 4 publications

References 33 publications

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Self‐healing, low oil leakage and recyclable thermally conductive Al₂O₃/boron nitride@siloxane composites based on reversible dynamic network

Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate

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Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging

Cited by 4 publications

References 33 publications

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Highly Thermally Conductive Triple-Level Ordered CNT/PVA Nanofibrous Films

Self‐healing, low oil leakage and recyclable thermally conductive Al2O3/boron nitride@siloxane composites based on reversible dynamic network

Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate

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Self‐healing, low oil leakage and recyclable thermally conductive Al₂O₃/boron nitride@siloxane composites based on reversible dynamic network