2020
DOI: 10.1016/j.polymer.2020.122831
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Non-thermal plasma activation of BPDA-PPD polyimide for improved cell-material interaction

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Cited by 13 publications
(9 citation statements)
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“…Then, air was introduced in the reactor at a flow rate of 1.0 standard litre per min (slm) and the pressure was raised to 5.0 kPa. Plasma was ignited at this moment, with a discharge power of 3.0 W. The samples were exposed to the air plasma for 1.0 s, a previously optimized parameter for BPDA-PPD polyimide [100].…”
Section: Sample Preparationmentioning
confidence: 99%
“…Then, air was introduced in the reactor at a flow rate of 1.0 standard litre per min (slm) and the pressure was raised to 5.0 kPa. Plasma was ignited at this moment, with a discharge power of 3.0 W. The samples were exposed to the air plasma for 1.0 s, a previously optimized parameter for BPDA-PPD polyimide [100].…”
Section: Sample Preparationmentioning
confidence: 99%
“…In our previous works, it has been demonstrated that modification of polylactide, 10,11 polyurethane, 12 polyethylene, 13 and chitosan films by cold plasma treatment facilitated interaction between cells and polymer surfaces. It has been established 7 that plasma activation of the rigid‐chain polyimide BPDA‐PPD in air and in argon led to a significant increase in surface reactivity toward cells.…”
Section: Introductionmentioning
confidence: 99%
“…6 Polyimides are weakly hydrophilic materials; therefore, it is necessary to increase hydrophilicity of the surface of a PI-based material in order to use it as a film scaffold in cell cultivation. This may be realized 7 by activation of the surface by dielectric barrier discharge (DBDs) plasma at high frequencies (higher than 1 kHz) at atmospheric pressure. Usually, the main goal of plasma treatment is accumulation of functional groups on polymer surface.…”
Section: Introductionmentioning
confidence: 99%
“…Aromatic polyimide (PI) material, possessing excellent comprehensive properties, has been wildly applicated in aviation, aerospace, 1 automobile, electrical appliances, 2 micro‐electronics, 3 separation membranes 4 and other fields 5 . Due to its stable aromatic heterocyclic structure, PI presents remarkable temperature resistance (−269 ~ 400°C), excellent thermal and chemical stability, 6 outstanding mechanical properties, 7 radiation resistance and other significant characteristics 8,9 . At present, the traditional synthesis method is that the precursor polyamide acid (PAA) has to be synthesized with high molecular weight to get high performance, 10,11 which generated high viscosity in solution, therefore restricting the subsequent processing, especially when PI is used in coatings, 12 films, 13 adhesives and photoresists 14 …”
Section: Introductionmentioning
confidence: 99%
“…5 Due to its stable aromatic heterocyclic structure, PI presents remarkable temperature resistance (−269 400 C), excellent thermal and chemical stability, 6 outstanding mechanical properties, 7 radiation resistance and other significant characteristics. 8,9 At present, the traditional synthesis method is that the precursor polyamide acid (PAA) has to be synthesized with high molecular weight to get high performance, 10,11 which generated high viscosity in solution, therefore restricting the subsequent processing, especially when PI is used in coatings, 12 films, 13 adhesives and photoresists. 14 Generally, for better film formation, the solid content of PAA resin solution prepared by polymerization reaction is less than 20%, which may not meet the thickness requirement for use.…”
mentioning
confidence: 99%