“…It is known that the resistive switching in the oxide layer of MDM structures underlying the memory device operation is usually provided by the mobility of anionic (VO) vacancies [20,25,27,28,29,31,32,33], ions of impurity metals [18,19,20,24,26,33,34,35] or Zr + [16,28,36] in the active layer under an external electric field. The electrical resistance of the memristor in lowresistance (LRS), high-resistance (HRS) and intermediate states are governed by the thickness and imperfection of the dioxide layer [23,24,28,31,32,37].…”