Nonlinear Damage Accumulation Rule for Solder Life Prediction Under Combined Temperature Profile With Varying Amplitude

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

“…Electro thermo-mechanical stresses and strains through the bodies of electronic packages are the most probable failure mechanisms occurring in electronic devices because of the multilayer structure of the electronic system (Lai et al, 2016;Li et al, 2009;Chen et al, 2019). This failure mechanism is intensified by a creep primary damage mechanism in Sn-Ag-Cu solder during any kind of thermal swings.…”

Role of alternating current shape on microstructure and damage evolution of solder joints

“…In fact, the integration of electronic modules comes at the expense of accelerated damage evolution in their vulnerable electronic parts, especially solder joints [5][6][7]. Thermal cycling, vibrational frequencies, electric current effects and harsh environmental situations are factors influencing reliability of solder joints [8][9][10][11][12][13]. Among them, the electric current with different failure mechanisms plays a significant role on the solder degradation.…”

Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

“…Meanwhile, it was found that the solder joints are one of the main vulnerable parts in these systems (Park et al , 2020; Surendar et al , 2018; Cheng et al , 2018; Wild et al , 2017; Samavatian et al , 2018; Ghahi and Sanaeirad, 2018). Thermal cycling, power cycling, harsh environment, electro-migration and dynamic loadings are examples of external excitations leading to the degradation of solder interconnections (Jie et al , 2018; Surendar et al , 2018; Choi et al , 2018; Mei et al , 2019; Chen et al ,2019; Sadeghpour and Mirzaei, 2018). However, thermal and power cycling processes are the events which affect most of the electronic systems.…”