Nonlinearities Associated with Impaired Sensors in a Typical SHM Experimental Set-Up

Abstract

Structural Health Monitoring (SHM) gives a diagnosis of a structure assessing the structural integrity and predicting the residual life through appropriate data processing and interpretation. A structure must remain in the design domain, although it can be subjected to normal aging due to usage, action of the environment, and accidental events. SHM involves the integration of electronic devices in the inspected structure that sometimes are Piezoelectric Transducers (PZT). These are lightweight and small and can be produced in different geometries. They are used both in guided wave-based and electromechanical impedance-based methods. The PZT bonding requires essential steps such as preparation of the surfaces, application of the adhesive, and assembly that make the bonding process not so easy to be realised. Furthermore, adhesives are susceptible to environmental degradation. Transducer debonding or non-uniform distributed glue underneath the sensor causes the reduction of the performance and can affect the reliability of the SHM system. In this paper, a sensor diagnostic method for the monitoring of the PZT operational status is proposed in order to detect bonding defect/damage between a PZT patch and a host structure. The authors propose a method based on the nonlinear behaviour of the contact PZT/structure that allows the identification of the damaged PZT and the geometrical characterization of the debonding. The feasibility of the diagnostic procedure is demonstrated by numerical studies and experiments, where disbonds were created by inhibiting the adhesive action on a part of the interface through Teflon film. The proposed method can be used to evaluate the sensor functionality after an extreme loading event or over a long period of service time.

Low‐power global navigation satellite system‐enabled wireless sensor network for acoustic emission localisation in aerospace components

“…Figure illustrates the experimental set‐up and the aluminium test component. Four piezo‐sensors (PI 000041371), with piezo‐electric coefficient values d 31 , d 33 , and d 15 equal to −180 × 10 −12 C/N, 400 × 10 −12 C/N, and 550 × 10 −12 C/N, respectively, were bonded on the surface of the plate and connected to each single wireless node. The remote main node was then connected to the PC via a USB port to receive AE data from each wireless unit.…”