Nonmetallic crystals with high thermal conductivity

Slack, Glen A.

doi:10.1016/0022-3697(73)90092-9

Cited by 1,793 publications

(944 citation statements)

References 51 publications

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“…Our work will focus on a relatively low temperature (300 K for the Al/GaN case and 10 K for the LJ system), although for comparison reasons selected cases are also explored at higher and lower temperatures. Note that the GaN Debye temperature estimated by different groups ranges from 350 K to 600 K [52][53][54] . Although 300 K is at the lower bound of the estimated Debye temperature range, we emphasize again that our objective is not to extract quantitative data for specific materials but rather to discover functional dependence of Kapitza conductance on interfacial structures.…”

Section: B Direct Methods Molecular Dynamics Modelmentioning

confidence: 99%

Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

et al. 2013

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Thermal boundary resistance dominates the overall resistance of nanosystems. This effect can be utilized to improve the figure of merit of thermoelectric materials. It is also a concern for thermal failures in microelectronic devices. The interfacial resistance sensitively depends on many interrelated structural details including material properties of the two layers, the system dimensions, the interfacial morphology, and the defect concentrations near the interface. The lack of an analytical understanding of these dependences has been a major hurdle for a science-based design of optimum systems on a nanoscale. Here we have combined an analytical model with extensive, highly-converged direct method molecular dynamics simulations to derive analytical relationships between interfacial thermal boundary resistance and structural features. We discover that thermal boundary resistance linearly decreases with total interfacial area that can be modified by interfacial roughening. This finding is further elucidated using wave packet analysis and local density of state calculations.

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Section: B Direct Methods Molecular Dynamics Modelmentioning

confidence: 99%

Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

et al. 2013

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“…The lattice distortion due to aluminium vacancies resulting from incorporation of oxygen into the lattice leads to increased phonon scattering, thus lowering the thermal conductivity of the material [25,[42][43][44][45][46].…”

Section: Aluminium Nitridementioning

confidence: 99%

A review of the processing, composition, and temperature-dependent mechanical and thermal properties of dielectric technical ceramics

et al. 2011

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The current review uses the material requirements of a new space propulsion device, the Variable Specific Impulse Magnetoplasma Rocket (VASIMR ® ) as a basis for presenting the temperature dependent properties of a range of dielectric ceramics, but data presented could be used in the engineering design of any ceramic component with complementary material requirements. A material is required for the gas containment tube (GCT) of VASIMR ® to allow it to operate at higher power levels. The GCT's operating conditions place severe constraints on the choice of material. A dielectric is required with a high thermal conductivity, low dielectric loss factor, and high thermal shock resistance. There is a lack of a representative set of temperature-dependent material property data for materials considered for this application and these are required for accurate thermo-structural modelling. This modelling would facilitate the selection of an optimum material for this component. The goal of this paper is to determine the best material property data values for use in the materials selection and design of such components. A review of both experimentally and theoretically-determined temperature-dependent & room temperature properties of several materials has been undertaken. Data extracted are presented by property. Properties reviewed are density, Young's, bulk and shear moduli, Poisson's ratio, tensile, flexural and compressive strength, thermal conductivity, specific heat capacity, thermal expansion coefficient and the factors affecting maximum service temperature. Materials reviewed are alumina, aluminium nitride, beryllia, fused quartz, sialon and silicon nitride.

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“…To compare the thermal conductivities of many different III-V and IV-VI materials, we normalized their thermal conductivities by harmonic properties using the formula suggested by Slack 10 . The formula gives reasonable predictions for many materials with zincblende and rocksalt structures 11 .…”

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confidence: 99%

Resonant bonding leads to low lattice thermal conductivity

et al. 2014

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Understanding the lattice dynamics and low thermal conductivities of IV-VI, V 2 -VI 3 and V materials is critical to the development of better thermoelectric and phase-change materials. Here we provide a link between chemical bonding and low thermal conductivity. Our first-principles calculations reveal that long-ranged interaction along the /100S direction of the rocksalt structure exist in lead chalcogenides, SnTe, Bi 2 Te 3 , Bi and Sb due to the resonant bonding that is common to all of them. This long-ranged interaction in lead chalcogenides and SnTe cause optical phonon softening, strong anharmonic scattering and large phase space for three-phonon scattering processes, which explain why rocksalt IV-VI compounds have much lower thermal conductivities than zincblende III-V compounds. The new insights on the relationship between resonant bonding and low thermal conductivity will help in the development of better thermoelectric and phase change materials.

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Nonmetallic crystals with high thermal conductivity

Cited by 1,793 publications

References 51 publications

Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

A review of the processing, composition, and temperature-dependent mechanical and thermal properties of dielectric technical ceramics

Resonant bonding leads to low lattice thermal conductivity

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