The nanogap memory (NGM) device, emerging as a promising
nonvolatile
memory candidate, has attracted increasing attention for its simple
structure, nano/atomic scale size, elevated operating speed, and robustness
to high temperatures. In this study, nanogap memories based on Pd,
Au, and Pt were fabricated by combining nanofabrication with electromigration
technology. Subsequent evaluations of the electrical characteristics
were conducted under ambient air or vacuum conditions at room temperature.
The investigation unveiled persistent challenges associated with metal
NGM devices, including (1) prolonged SET operation
time in comparison to RESET, (2) the potential generation of error
bits when enhancing switching speeds, and (3) susceptibility to degradation
during program/erase cycles. While these issues have been encountered
by predecessors in NGM device development, the underlying causes have
remained elusive. Employing molecular dynamics (MD) simulation, we
have, for the first time, unveiled the dynamic processes of NGM devices
during both SET and RESET operations. The MD simulation highlights
that the adjustment of the tunneling gap spacing in nanogap memory
primarily occurs through atomic migration or field evaporation. This
dynamic process enables the device to transition between the high-resistance
state (HRS) and the low-resistance state (LRS). The identified mechanism
provides insight into the origins of the aforementioned challenges.
Furthermore, the study proposes an effective method to enhance the
endurance of NGM devices based on the elucidated mechanism.