Novel CMP slurries for planarization of multilevel copper interconnect

Song, Jae-Hoon; Chen, Y.H.; Lee, S.N.; Chiou, W.C.; Tseng, Tzyy-Jang; Kuo, H.H.; Chuang, Chern; Lin, Kaiqi; Jang, Sun‐Joo; Liang, Mong–Song

doi:10.1109/vlsit.2003.1221116

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“…Researchers in the recent past have studied mixed or modified abrasive particles in order to reduce defects during CMP (9)(10)(11)(12). These studies mostly use abrasives of different inorganic oxides and of different sizes or use micelles etc.…”

Section: Introductionmentioning

confidence: 99%

Novel Hybrid Abrasive Particles for Oxide CMP Applications

et al. 2007

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In the present research, novel abrasive particles are investigated in order to carry out CMP at relatively low down force (low mechanical stress) yet achieve desirable removal rates and superior post CMP surface quality (reduced scratches). Hybrid abrasives are developed where the composition of the polymeric particles formed via colloidal precipitation is modified with inorganic segments to reduce surface damage during CMP. The composition is controlled by changing the time for condensation and hydrolysis of the inorganic oxide. Characterization of these particles is performed by FTIR spectroscopy, dynamic light scattering, and electron microscopy (TEM/SEM). Tribological characteristics during polishing employing these novel particles are studied on a bench-top CMP tester. Surface roughness and defectivity are estimated using Atomic Force Microscopy (AFM).

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Section: Introductionmentioning

confidence: 99%