Novel Decapsulation Method for Silver-Based Wire-Bond Semiconductor Packages With High Reliability Using Mixed Salt–Acid Chemistry

Kim, Young-Ja; Hah, Jinho; Moon, Kyoung‐Sik; Wong, C. P.

doi:10.1109/tcpmt.2019.2923145

Cited by 1 publication

(1 citation statement)

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“…A key factor in the failure of wire bond packages is the decapsulation process. Maintaining the wires in their packaging without causing any damage is essential while removing polymer encapsulants like epoxy molding compounds (EMC) [11]. When a device is decapsulated, the whole mold compound should be removed from the desired location without affecting the electrical properties of the device.…”

Section: Introductionmentioning

confidence: 99%

Study Of Decapsulation On IC With Temperature And Volume H2SO4 Variation

Budiana,

Aryeni,

Maulidiah

et al. 2024

Proceedings of the 6th International Conference on Applied Engineering, ICAE 2023, 7 November 2023, Batam, Riau Islands, Indone

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Decapsulation is the process of opening the polymer layer covering the die. The purpose of decapsulation on IC is to facilitate checks on the quality of the die. The method carried out in this study uses the method of dripping H2SO4 on the IC surface. The variables to be examined in this study are variations in the use of H2SO4 volume and H2SO4 temperature. The volume variation used consists of 0.1130 ml (10 drops), 0.1356 ml (12 drops) and 0.1582 ml (14 drops). While the temperature variation used in this study consisted of 165 °C, 170 °C and 175 °C. The results showed that all samples is not completed decapsulation process. Some samples (B, C, E, F, H, and I) is partial decapsulation while other sample is not open die at all. Moreover, Sample C exhibits the greatest thickness reduction among all the samples under examination, and the die is distinctly visible.

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Section: Introductionmentioning

confidence: 99%