“…95, No. 10, October 2008, 999-1007 (Keating and Meyer 1987;Favalli, Olivo, Damiani, and Ricco 1990;Tang, Lee, and Liu 1995): a) it can reduce test equipment cost; b) the testing rate can be increased; c) it can improve the detectability and observability of faults in the CUT; d) higher current sensing resolution can be achieved and e) it can avoid the influence of I/O current, which may dominate the total chip's current.…”