Novel Failure Isolation Techniques for Circuits Sensitive to Microprobe

Fan, Dazhong; Wu, Miao; Joe, Yu; Wang, Winter; Wu, Chunlei; Li, Jinglong; Liu, Tian

doi:10.1109/isdea.2012.399

Cited by 3 publications

(1 citation statement)

References 3 publications

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“…Suspected IV curves were measured focused on several signals which can pull up the TP8 signal, but no anomaly was found [3]. When failure was isolated on one single signal and no main control signal failure was found, metal bridge or particle was highly suspected based on the failed signal wiring in layout.…”

Section: Real Case Analysismentioning

confidence: 99%

Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Wen¹

2014

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Microprobe analysis plays an important role in failure analysis as it could reveal the failed signal directly and help to isolate the final failed device. But when met unexpected high impedance circuit, the real signal couldn't be measured as high impedance site was sensitive to probe needle and strong light. One real Case and experiment was studied in this paper to show how high impedance circuit was sensitive and how to find the root cause of this unstable failure efficiently.

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Section: Real Case Analysismentioning

confidence: 99%

Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Wen¹

2014

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Failure analysis of complicated case by functional OBIRCH method

Fan¹,

Liu²,

Wu³

et al. 2013

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Combined Emission with simulation technique to resolve unstable failure mode sample

Fan¹,

Wang²,

Liu³

et al. 2012

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)

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Failure analysis (FA) of semiconductor should base on a specific failure mode. But the failure mode has potential risk that it may change due to it is unstable (caused by weak defect or voltage stress etc). The change of unstable failure mode can occur in every stage of FA flow. If the change happens, typical FA flow cannot be continued base on the failure mode any more. The change of unstable failure mode in different stage will impact the final FA result deeply. In this situation, combined failed device simulation with emission result is a good choice to resolve unstable failure mode sample. This paper introduces the solution that combined Emission technique with simulation to resolve the unstable failure mode sample.

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Novel Failure Isolation Techniques for Circuits Sensitive to Microprobe

Cited by 3 publications

References 3 publications

Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Failure analysis of complicated case by functional OBIRCH method

Combined Emission with simulation technique to resolve unstable failure mode sample

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