Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability

Emadi, Fahimeh; Vuorinen, Vesa; Liu, Shenyi; Paulasto-Kröckel, Mervi

doi:10.1109/tcpmt.2024.3430061

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3430061

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Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability

Fahimeh Emadi,

Vesa Vuorinen,

Shenyi Liu

et al.

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Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

Wernicke,

Rebhan,

Vuorinen

et al. 2024

ECS J. Solid State Sci. Technol.

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An overview of various low-temperature (<200°C) wafer bonding processes using metal interlayers is presented. Such processes are very attractive for novel applications in 3D heterogenous packaging as the allow for simultaneous formation of electrical interconnects, as well as hermetic encapsulation of various sensors and microelectromechanical systems-based devices. Metal wafer bonding is a generic category of processes consisting of various sub-categories, each one defined by the different principles governing the process. One can differentiate between eutectic wafer bonding (a eutectic alloy is formed as bonding layer during the process by liquid-solid interdiffusion), intermetallic wafer bonding (an intermetallic alloy is formed as bonding layer during the process by solid-liquid interdiffusion, a process known also as solid liquid intermetallic diffusion transient liquid phase, and metal thermo-compression wafer bonding. Different critical/gating parameters were investigated and their impact for generally reducing processing temperatures for the different metal bonding systems was studied.

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Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

Wernicke,

Rebhan,

Vuorinen

et al. 2024

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

show abstract

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Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability

Cited by 1 publication

References 37 publications

Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

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