Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Application of Dual Silane Coupling Agent-Assisted Surface-Modified Quartz Powder in Epoxy Matrix for Performance Enhancement

“…Usually, the state of filler dispersion and interface interaction between the filler and the matrix are closely related to the rheological properties of polymer composites [47]. Moreover, a low viscosity is very helpful for the subsequent electronic packaging process [48,49]. The effects of different SCAs on the shear viscosity of the EP composites under 50 wt.% filler loading at 40 • C are shown in Figure 7a-c.…”

“…The load of QP significantly influenced the streamline of the EP, and the friction between the QP and the EP matrix resulted in a large anelasticity, such that all the QP-EP composites exhibited higher viscosities than that of the pure EP [50]. Usually, the state of filler dispersion and interface interaction between the fille the matrix are closely related to the rheological properties of polymer composites Moreover, a low viscosity is very helpful for the subsequent electronic packaging pr [48,49]. The effects of different SCAs on the shear viscosity of the EP composites und…”

A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al2O3 clusters

“…For example, Fu et al 28 prepared a series of dense boric acid modied BNNSs/EP composites by mechanical ball milling and pressure forming processes; the EP composites with 90 wt% BNNSs achieved the maximum thermal conductivity (6.7 W m À1 k À1 ) and the minimum CLTE (4.5 ppm/ C) at a temperature of 25 C. Unfortunately, high ller loading will inevitably cause a sharp increase in the viscosity of silicone potting adhesive, which makes it impossible to achieve potting under mechanical or articial conditions. 29 In this study, Al 2 O 3 -epoxy and Al 2 O 3 -NH 2 powders were equally lled in vinyl silicone oil to prepare a high Al 2 O 3 loading (89 wt%) precursor of silicone potting adhesive. The viscosity of the precursor was greatly reduced through the reaction of Al 2 O 3epoxy and Al 2 O 3 -NH 2 powders, and a mechanism of viscosity reduction was proposed.…”

“…Unfortunately, high filler loading will inevitably cause a sharp increase in the viscosity of silicone potting adhesive, which makes it impossible to achieve potting under mechanical or artificial conditions. 29 …”

Enhancing the thermal and electrical conductivities of silicone rubber composites by constructing a 1D‐3D collaborative network

“…With the formation of a filler long-chain structure or three-dimensional heat conduction network in the polymer matrix, the thermal conductivity increases rapidly and reaches the percolation threshold. [31][32][33][34] By mimicking the compression characteristics of natural sponges, Zhang et al fabricated a fully 3D interconnected porous PZT network based on polyurethane foam, which dramatically improved the stress transfer capability and piezoelectric and thermoelectric performance. With 16 vol% PZT, the output voltage of the piezoelectric nanogenerator was enhanced to 5 V. [35] Huang et al introduced carbon black and graphene nanoplatelets into silicone rubber, in which the fillers are interconnected with each other to form a 3D framework.…”