Novel Opto-Electronical Probe Card for Wafer-Level PIC Testing

High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits

“…. ., [15][16][17][18][19][16][17][18]. Fingers 1 and 17 are not used in this experiment, so 15 pairs (30 connections) were tested.…”

“…Edge-coupled devices have the advantage of broadband optical response, but access to the waveguide is not available until after the chips have been singulated from the wafer. Since the mode size of a standard single-mode fiber (SMF) and the waveguide may differ significantly (typically a factor [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], either mode-size converters are required or sub-micron alignment may be needed, or a combination of both. Grating couplers couple out-of-plane to a near-vertical direction and are manufacturable in thin membranetype high-contrast waveguides, typically in Si-based integration technologies.…”

“…Although more advanced solutions using multiple port optical interposers for vertical coupling combined with electrical probing have been reported [15], these still rely on grating couplers, require active alignment and are not suited for edge emitting photonic integration platforms. For multi-port testing and on-wafer probing, probe heads have been reported using technology with a total internal reflection element that redirects the light collected from a trench in front of on-wafer waveguides [16], [17].…”