Novolak Resist Removal by Laser Irradiation (532 nm) and Adhesion between Resist and Substrate

Nuno

Kuroki

et al. 2016

Self Cite

Removal by using laser irradiation was investigated in Poly-Vinyl Phenol (PVP). The laser irradiation in the water can improve the PVP stripping effect as compared with that of normal atmosphere irradiation. The surface laser damage threshold of Si wafer was 0.13 J/cm 2 , and the PVP stripping threshold was 0.06 J/cm 2 . The PVP stripping threshold decreased to approximately 50 % of the surface laser damage threshold. The PVP strips from the Si wafer just as shown in a positive-tone DNQ / novolak resist. However, removal efficiency decreased at a large irradiation beam diameter. The stripped area decreases at the beam diameter of 1.5mm or more. Irradiation with multiple laser beams with a small beam diameter could improve the PVP stripping rate with high efficiency.

Section: Introductionmentioning

confidence: 60%

Removal Technology of Poly-Vinyl Phenol Using Laser Irradiation

Nuno

Kuroki

et al. 2016

Self Cite

“…[13,14]. An advanced laser resist stripping method was successfully developed without causing laser damage to the Si wafer [15].…”

Section: Introductionmentioning

confidence: 99%

Analysis of Resist Removal Phenomenon Using Laser Irradiation

Kuramae

Yamashiro

et al. 2017

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Resist removal phenomenon with laser irradiation was analyzed by using a finite element (FE) method. Laser irradiation in the water can improve the resist removal effect as compared with that of normal atmosphere irradiation. A two-dimensional (2-D) micro-FE model was constructed based on the boundary surface between the Si wafer, resist and water during laser radiation. In the normal atmosphere, any effective stress did not occur along the x-axis direction in the resist. In contrast, for the laser irradiation in the water, large compressive stress was confirmed along the x-axis direction in the resist. This compressive stress in the resist is thought to improve the resist removal efficiency.

“…The removal of the resist by laser irradiation instead of chemicals has the advantage of reducing environmental risks [13,14]. An advanced laser resist stripping method for the positive-tone diazonaphthoquinone (DNQ) / novolak resist was successfully developed without causing the laser damage to the Si wafer [15].…”

Section: Introductionmentioning

confidence: 99%

Dependence on Resist Stripping Efficiency to Irradiating Beam Size in Advanced Laser Resist Stripping Method

Kuroki

Murakami

et al. 2015

Self Cite

Dependence on the stripping efficiency to irradiating beam size was investigated in an advanced laser resist stripping method. The beam size on the resist surface was changed from 0.3 mm to 3.0 mm. An intensity shape of the laser beam was Gaussian shape. At a beam diameter of 0.3mm, the stripped resist area in a beam was 15 % of 0.01 mm 2 . In the case of beam diameter of 3.0 mm, the stripped resist area in a beam was 5 % of 0.38 mm 2 . The stripped area improves 38 times for scale-up of the beam area of 100 times. The resist stripping efficiency was thought to depend on the heat stress due to a temperature gradient between the beam center and the regions without laser irradiation. Irradiation with multiple laser beams by small beam diameter was confirmed as one of the methods for improvement of a resist stripping rate with high efficiency.