Nucleation and growth of Au and Au–Pd nanoparticles at the beginning of electrochemical deposition

Fratini, Emiliano; Girella, Alessandro; Saldan, Ivan; Milanese, Chiara; Dobrovetska, Oksana; Sus, Lyubov; Okhremchuk, Yevhen; Кuntyi, О. І.; Reshetnyak, Оleksandr

doi:10.1016/j.matlet.2015.08.117

Cited by 12 publications

(4 citation statements)

References 24 publications

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“…Irregular surface coverage could be partly a result of the nanoparticle growth through coalescence and recrystallization of neighboring nuclei particles. 74,75 In 1 : 2 ChCl : EG, on the other hand, the coating was smoother, though very uneven in chemical composition. The surface was covered with a thin film composed mostly of gold, but occasionally incorporating some amount of copper.…”

Section: Process Efficiencymentioning

confidence: 99%

Mechanism of selective gold extraction from multi-metal chloride solutions by electrodeposition-redox replacement

et al. 2020

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Section: Process Efficiencymentioning

confidence: 99%

Mechanism of selective gold extraction from multi-metal chloride solutions by electrodeposition-redox replacement

et al. 2020

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“…Numerous studies have been conducted to understand the nucleation and growth phenomenon of metal ECD on various electrode materials. ,, For example, Ustarroz et al showed that the early stages of Pt electrochemical growth on carbon substrates may be affected by the aggregation, self-alignment, and partial coalescence of nanoclusters ∼2 nm in diameter . Pesika and co-workers showed that by tuning the ECD of Ag on an Ag electrode within the reaction-controlled regime, where the current increases exponentially with applied overpotential, the island nucleation density can be systematically varied and thin films with varied roughness can be formed .…”

Section: Introductionmentioning

confidence: 99%

Size-Dependent Electrochemical Metal Growth Kinetics

Nambiar

2023

J. Phys. Chem. C

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This work explores the electrochemical deposition (ECD) of Au onto chemically preformed Au nanoparticles (NPs) as a function of Au NP size. The growth potential and current depend strongly on the size of the preformed Au NPs (seeds) due to different Au NP size-dependent kinetics of the growth process. Electrochemical reversibility depends on the Au NP size, scan rate, metal precursor concentration ([AuCl 4− ]), and Au NP coverage. The Au NPs need to reach a critical total surface area to have enough active area to cause the ECD over the entire electrode to be electrochemically reversible and operate under linear diffusion mass transfer-limited conditions. The smaller Au NPs require less total surface area to reach this condition because they have higher activity per surface area, which is not fully understood but could be due to a greater percentage of defects on their surface, such as edge and corner atom sites.

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“…Recently, Au-coated surfaces garnered increasing interest in novel applications, such as fuel cells, electrochemical sensing, energy storage and catalysis [ 23 ]. Electrochemically deposited Au nanoparticles appear to be of high importance due to high catalytic activity in chemical reactions, synthesized and incorporated into distinct surfaces [ 24 , 25 , 26 , 27 , 28 ]. The electrodeposition of Au also provides a good platform for membrane technologies suitable for gas-sensing processes [ 29 ].…”

Section: Introductionmentioning

confidence: 99%

Facile and Electrically Reliable Electroplated Gold Contacts to p-Type InAsSb Bulk-Like Epilayers

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Wróbel

Boguski

et al. 2021

Sensors

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Narrow band-gap semiconductors, namely ternary InAsSb alloys, find substantial technological importance for mid-infrared application as photodetectors in medical diagnostics or environmental monitoring. Thus, it is crucial to develop electrical contacts for these materials because they are the fundamental blocks of all semiconductor devices. This study demonstrates that electroplated gold contacts can be considered as a simple and reliable metallization technology for the electrical-response examination of a test structure. Unalloyed electroplated Au contacts to InAsSb exhibit specific contact resistivity even lower than vacuum-deposited standard Ti–Au. Moreover, temperature-dependent transport properties, such as Hall carrier concentration and mobility, show similar trends, with a minor shift in the transition temperature. It can be associated with a difference in metallization technology, mainly the presence of a Ti interlayer in vacuum-deposited contacts. Such a transition may give insight into not only the gentle balance changes between conductivity channels but also an impression of changing the dominance of carrier type from p- to n-type. The magnetotransport experiments assisted with mobility spectrum analysis clearly show that such an interpretation is incorrect. InAsSb layers are strongly p-type dominant, with a clear contribution from valence band carriers observed at the whole analyzed temperature range. Furthermore, the presence of thermally activated band electrons is detected at temperatures higher than 220 K.

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Nucleation and growth of Au and Au–Pd nanoparticles at the beginning of electrochemical deposition

Cited by 12 publications

References 24 publications

Mechanism of selective gold extraction from multi-metal chloride solutions by electrodeposition-redox replacement

Mechanism of selective gold extraction from multi-metal chloride solutions by electrodeposition-redox replacement

Size-Dependent Electrochemical Metal Growth Kinetics

Facile and Electrically Reliable Electroplated Gold Contacts to p-Type InAsSb Bulk-Like Epilayers

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