Nucleation behavior in electroless displacement deposition of metals on silicon from hydrofluoric acid solutions

Yae, Shinji; Nasu, Noriaki; Matsumoto, Keīichi; Hagihara, Taizo; Fukumuro, Naoki; Matsuda, Hitoshi

doi:10.1016/j.electacta.2007.04.058

Cited by 105 publications

(98 citation statements)

References 26 publications

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“…This is consistent with our previously reported results [16]. The particle density of the Ag nanoparticles is independent of the surface condition of the n-Si (100) substrates.…”

Section: Multi-and Micro-crystalline Si Substratessupporting

confidence: 94%

“…The Ag particle density was 1.4 x 10 11 cm -2 for deposition at 313 K for one s. These results show that the nucleation activity of Ag on Si is high enough to instantaneously produce high and constant density of nanoparticles on various kinds of Si substrates. On the contrary, platinum particle density is much lower than Ag and depends on the surface condition of the Si substrates [16]. The depth of the nanopores formed by metal-particle-assisted etching was almost independent of the kind of Si substrates.…”

Section: Multi-and Micro-crystalline Si Substratesmentioning

confidence: 98%

“…The method consists of the three electroless steps shown in Fig. 1: Step 1) displacement deposition of metal nanoparticles [16];…”

mentioning

confidence: 99%

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Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Yae

Sakabe

Hirano

et al. 2010

Phys. Status Solidi C

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Metal‐particle‐assisted hydrofluoric acid etching of silicon (Si) is a unique method of preparing Si nanopores with metal nanoparticles at the bottom of each nanopore. Autocatalytic electroless deposition, which is the conventional method to metalize nonmetallic substrates, requires catalyzation of the substrates before deposition. For Si substrates, obtaining adhesive metal films with conventional catalyzation pretreatments is difficult. We recently developed a new method to produce adhesive metal films on Si substrates using catalytic nanopores that consists of three steps: 1) displacement deposition of metal nanoparticles; 2) Si nanopore formation by metal‐particle‐assisted hydrofluoric acid etching; and 3) autocatalytic electroless deposition of metal films. In this study, the new method is applied not only to previously reported p‐Si (100) 1 Ω cm substrates but also to various Si substrates, such as low and high resistibility, p‐ and n‐types, (100), (111), and (110) planes, and single‐, multi‐ and micro‐crystalline substrates. Adhesive and bright metal films were formed on all Si substrates. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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“…This is consistent with our previously reported results [16]. The particle density of the Ag nanoparticles is independent of the surface condition of the n-Si (100) substrates.…”

Section: Multi-and Micro-crystalline Si Substratessupporting

confidence: 94%

Section: Multi-and Micro-crystalline Si Substratesmentioning

confidence: 98%

See 1 more Smart Citation

Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Yae

Sakabe

Hirano

et al. 2010

Phys. Status Solidi C

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“…We recently reported similar results in the Si-surface-condition dependence of noble metal particle density deposited on n-Si by electroless displacement deposition from HF containing a metal salt solution, which involves the local cathodic reduction of metal ions and local anodic dissolution of Si [9]. Moreover, it was reported that noble metal particles were deposited on an Si surface from simple metal salt solutions containing no fluoride by displacement reaction, which involves the reduction of metal ions and the oxidation of Si [10].…”

Section: Resultssupporting

confidence: 51%

Influence of Displacement Reaction on Electrodeposition of Noble Metal Particles on Silicon

Yae

Kawai

Matsukawa

et al. 2010

Trans. Mat. Res. Soc. Japan

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“…Here the redox potentials are E 03 ¼ À0.86 V, E 04 ¼ 1.52 V. 38 Particle growth involves an initial nucleation phase with the formation of metallic nuclei and a steady state phase of growth. The shape and size of the nal structures depend on the concentration of reducing agents, temperature, time of reaction and type of metals.…”

Section: Electroless Deposition Of Metals On a Substratementioning

confidence: 99%

Relating the rate of growth of metal nanoparticles to cluster size distribution in electroless deposition

et al. 2019

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Electroless deposition on patterned silicon substrates enables the formation of metal nanomaterials with tight control over their size and shape. In the technique, metal ions are transported by diffusion from a solution to the active sites of an autocatalytic substrate where they are reduced as metals upon contact. Here, using diffusion limited aggregation models and numerical simulations, we derived relationships that correlate the cluster size distribution to the total mass of deposited particles. We found that the ratio x between the rates of growth of two different metalsdepends on the ratio g between the rates of growth of clusters formed by those metals g ¼. We then validated the model using experiments. Different from other methods, the model derives k using as input the geometry of metal nanoparticle clusters, decoded by SEM or AFM images of samples, and a known reference.

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Nucleation behavior in electroless displacement deposition of metals on silicon from hydrofluoric acid solutions

Cited by 105 publications

References 26 publications

Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Influence of Displacement Reaction on Electrodeposition of Noble Metal Particles on Silicon

Relating the rate of growth of metal nanoparticles to cluster size distribution in electroless deposition

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