“…[26][27][28][29][30][31][32] Over the past decade, various studies have been conducted to develop and optimize TENGs, [33][34][35][36][37][38][39][40] showing that their surface morphology, dielectric properties, device structure, and friction layer materials play important roles in determining their performance. [41][42][43][44][45][46] Most of the friction layer materials used to prepare TENGs are synthetic polymers, such as polydimethylsiloxane (PDMS), 47 polyvinylidene diuoride (PVDF), 48 polyethylene terephthalate (PET), 49 polyurethane (PU), 50 polyimide (PI), 51 uorinated ethylene propylene (FEP), 52 and poly-tetrauoroethylene (PTFE), 53 or metals materials such as aluminum (Al) 54 and copper (Cu). 55 However, these materials are associated with disadvantages, such as being high cost, difficult to decompose, requiring complex manufacturing processes, and exhibiting non-biological compatibility.…”