“…It has become one of the most promising technologies to solve thermal management problems in various electronics with high power density, and has been successfully applied to electronic chips and laser devices. After that, a large number of scholars proposed many improvement methods, such as turbulence structure [6,7], secondary flow [8,9], pulse flow [10,11], nanofluid [12,13], surface modification [14], and rough surface [15,16], from the directions of discussing heat exchange law [17,18], improving heat dissipation efficiency [19,20], improving flow field and temperature uniformity [21,22], and reducing pressure drop [23,24].…”