Numerical development of EHD cooling systems for laptop applications

Ramadhan, Abdulmajeed A.; Kapur, Nikil; Summers, J. L.; Thompson, H. M.

doi:10.1016/j.applthermaleng.2018.04.119

Cited by 62 publications

(17 citation statements)

References 30 publications

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“…Different researchers have applied the EHD technique for heat transfer enhancement in the heat sinks (Tang et al , 2020; Ramadhan et al , 2018; Wang et al , 2019). Tang et al (2020) experimentally investigated transferred heat in a rectangular microgrooves heat sink under a non-uniform electric field.…”

Section: Introductionmentioning

confidence: 99%

“…Their study revealed that the pin electrode utilization could boost the heat transfer performances and reduce the surface temperature of microgrooves efficiently. Ramadhan et al (2018) by using EHD blowers and a plate-fin heat sink produced an innovative cooling system for flat consumer electronics such as laptop applications. Their results illustrate that the suggested cooling method can perform effectively and control the temperature in the standard working range.…”

Section: Introductionmentioning

confidence: 99%

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Introduction of a novel electric field-based plate heat sink for heat transfer enhancement of thermal systems

Nourdanesh

Ranjbar

2021

HFF

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Purpose The purpose of this study is to use an electric field technique to design novel heat sinks capable of rejecting as much heat as possible in a limited space. Configuration of electrodes in this study can be used for increasing the efficiency of heat sinks. Design/methodology/approach This study investigates a novel electrohydrodynamic (EHD)-based heat sink for thermal management of electronic devices and thermal systems. The significant part of designing an EHD heat sink is the arrangement of the electrodes. A numerical simulation is performed for a heat sink with two parallel plates to determine the optimum dimensional configuration of electrodes. The upper plate of this heat sink is the ground electrode with a constant atmosphere temperature, and the lower plate of it with flush-mounted high-voltage electrodes has uniform heat flux. Findings The results show that heat transfer changes by the size of the vortices and the number of them. These vortices are emerged by the electric field, and the number of them increases with increasing the number of electrodes. The interaction of vortices size and number leads to having the lowest average temperature in the optimum case by two high voltage electrodes with widths of 7.5 mm and a 17.5 mm gap between them. In comparison with the case without the electric field, with increasing the applied voltage to 30 kV, the efficiency of this EHD heat sink increases up to 37%. Originality/value Improvements in electrical equipment make them more compact with higher heat fluxes. Hence, the amount of heat to be dissipated per area increases and needs thermal management to operate at their design temperatures. Therefore, to improve the performance and life span of electronic components and increase their efficiency, it is necessary to design heat sinks to decrease their maximum (peak) temperature.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Introduction of a novel electric field-based plate heat sink for heat transfer enhancement of thermal systems

Nourdanesh

Ranjbar

2021

HFF

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“…Transactions of the ASME Ramadhan et al [75] integrated a wire-to-plate EHD pump into a 2-mm-fin-pitch aluminum heat sink, as shown in Fig. 33, and demonstrated that the EHD pump is a promising thermal solution for the laptops.…”

Section: Reciprocatingmentioning

confidence: 99%

“…Beam fans usually operate in an open space with moderate airflow velocity but low pressure, while diaphragm pumps are able Fig. 33 The schematic of Ramadhan's EHD pump and heat sink [75] Fig. 34 The experimental setup and the three-dimensional-printed needle corona electrode.…”

Section: Comparisonmentioning

confidence: 99%

Recent Developments in Air Pumps for Thermal Management of Electronics

Wen

2021

Journal of Electronic Packaging

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For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to manage thermal issues of electronics. Air pump is used to initiate and sustain airflow required in forced convection. This paper reviews both the mechanical and the nonmechanical air pumps that have been using widely in current electronics or have a great potential in future electronics. The mechanical pumps include axial fans, blowers, beam fans, and diaphragm pumps, while the nonmechanical pump specifically focuses on electrohydrodynamic pumps. This paper presents the working principle first and then the recent developments, including the pump itself (design, characteristics, etc.) and the applications in thermal management (placement, integration, etc.). In the end, this paper conducts the strength analysis (flow rate, pressure, noise, flexibility, and reliability) among the reviewed five types of air pumps.

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“…Besides the experimental method for ionic wind study, many researchers have investigated the ionic wind characteristics via numerical simulation. Ramadhan AA [5] proposed an optimized EHD blowers integrated with a plate-fin heat sink is presented. This cooling system can be used for thin consumer electronics.…”

Section: Introductionmentioning

confidence: 99%