1991
DOI: 10.1016/0735-1933(91)90026-z
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Numerical estimation of hotspot temperatures in electrodes subjected to pulsed electron beam heating in vacuum

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Cited by 4 publications
(3 citation statements)
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“…This computer code has been validated by comparison with the analytical solution for a semiinfinite solid heated by a circular source [20]. This method has been discussed in greater detail in one of our previous papers [23]. The solution a t the origin [20] can be written as…”
Section: The Finite Difference Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…This computer code has been validated by comparison with the analytical solution for a semiinfinite solid heated by a circular source [20]. This method has been discussed in greater detail in one of our previous papers [23]. The solution a t the origin [20] can be written as…”
Section: The Finite Difference Methodsmentioning
confidence: 99%
“…A sufficiently accurate numerical solution for the transient temperature distribution in a cylindrical disc heated by a circular source at the surface using a finite difference method is presented. This computer code was validated by comparison with an analytical solution in our earlier work [23]. The effect of nonlinear variation of thermal properties with temperature and phase change (solid to liquid) is studied by computing the temperature distribution using ANSYS 4.4, a powerful finite element package.…”
Section: Introductionmentioning
confidence: 99%
“…This high power density and self-heating makes the batteries to drain briskly in portable devices and accordingly they must be cooled to a temperature at which the transistors can operate. Consequently, as long as the cooling technology has not got up with the miniaturization many electronic devices are impractical due to the millimeter-scale hotspots on the chip, which are localized zones with higher heat per unit area and accordingly higher temperatures [20][21][22][23][24][25]. On the other hand, while chip-level hotspots are troubling circuit designers [26,27], device designers are beginning to encounter thermal management problems at nanometer-length scales within individual transistors.…”
Section: Introductionmentioning
confidence: 99%