2019
DOI: 10.1016/j.promfg.2019.02.290
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Numerical Investigation of a MEMS Thermal Actuator Performance by Modifying its Geometric Dimensions

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Cited by 8 publications
(4 citation statements)
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“…For structural analysis, COMSOL3.5a is utilized in this work. For heat transfer, the conduction equation in the solid is considered [5] ๐œ•๐œ•๐ถ๐ถ ๐‘๐‘ โ‹… โˆ‡๐‘‡๐‘‡ + โˆ‡ โ‹… (โˆ’๐‘˜๐‘˜โˆ‡๐‘‡๐‘‡) = 0 (5) where ๐œ•๐œ• is the density (kg/m 3 ), CP is specific heat capacity (J/kgโ€ขK), T is the temperature (K) and k is the thermal conductivity (W/mโ€ขK).…”
Section: Structural Analysismentioning
confidence: 99%
“…For structural analysis, COMSOL3.5a is utilized in this work. For heat transfer, the conduction equation in the solid is considered [5] ๐œ•๐œ•๐ถ๐ถ ๐‘๐‘ โ‹… โˆ‡๐‘‡๐‘‡ + โˆ‡ โ‹… (โˆ’๐‘˜๐‘˜โˆ‡๐‘‡๐‘‡) = 0 (5) where ๐œ•๐œ• is the density (kg/m 3 ), CP is specific heat capacity (J/kgโ€ขK), T is the temperature (K) and k is the thermal conductivity (W/mโ€ขK).…”
Section: Structural Analysismentioning
confidence: 99%
“…The typical U-shaped structures of MEMS thermal actuators are used to solve the multi-physics fields coupling behavior in long-term performance, and the typical structures are shown in Figure 1 (Ionescu, 2019; Nasim et al., 2009; Wang et al., 2015). Previously, there have been some experimental and numerical studies on the behavior of multiple physical fields for the MEMS actuators (Alwan and Aluru, 2009; Azman et al., 2017; Chen et al., 2002).…”
Section: Development Of Creep Damage Model For Microelectromechanical...mentioning
confidence: 99%
“…All the equations governing Solid Mechanics interface from Comsol Multipysics software are presented in detail in a previous study [18].…”
Section: Model Formulationmentioning
confidence: 99%