2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2015
DOI: 10.1109/eurosime.2015.7103144
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Numerical investigation of ceramic package/ interposer interconnects using isotropic conductive adhesive

R. F. Hamou
1
,
Per Dalsjo
2
,
Cato Dørum
3
et al.
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