Abstract.A novel conductive adhesive is used to interconnect MEMS test structures with different pad sizes directly to a printed circuit board (PCB) in a medium caliber ammunition fuze. The fuze environment is very demanding, with a setback acceleration exceeding 60,000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures perform well when subjected to rapid temperature cycling according to military-standard 883G method 1010.8 test condition B. The test structures pass 100 temperature cycles, followed by a firing test where the test structures are exposed to an acceleration of more than 60,000 g. C 2010 Society of Photo-Optical Instrumentation Engineers.

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Polymer Core Solder Balls (PCSB) have been used as interconnects between a 16 pin leadless chip carrier (LCC) ceramic package and a small FR4 board. A comparison was made between two different volumes of SnPb solder and an isotropic conductive adhesive (ICA) for the attachment of the PCSB to the board and to the package. Shear testing and electrical measurements were performed to characterize the interconnects as bonded and during thermal shock cycling (TSC) tests. No significant reductions of the measured fracture forces was observed for any of the sample groups. However, using a larger volume of solder or ICA resulted in less degradation of interconnect resistance during TSC, and the results for the solder were overall better than for ICA.