2014
DOI: 10.1002/jnm.1995
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Numerical modeling and optimization of laser soldering for Micro‐USB electric connector

Abstract: SUMMARYThe laser soldering process was introduced in Micro-USB electronic packaging in this paper. Numerical modeling and analysis was used for laser process parameter design, because experimental measurements of peak temperature and soldering stress are expensive and often intractable. Accurate knowledge of the residual stress and distortion is a prerequisite for the reliability of the electric connector. The present work proposes a three-dimensional transient heat transfer model of Micro-USB package laser so… Show more

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Cited by 5 publications
(3 citation statements)
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“…Due to thermal cycling or mechanical stress, the solder joint may weaken or fail over time. On the other hand, if the temperature of the solder joint exceeds the target temperature, the electronic components being soldered may overheat, leading to oxidation, deformation, or even melting, which could also result in a decline in the quality of the solder joint [ 28 ]. Therefore, controlling the temperature of the solder joint is critically important in the laser soldering process.…”
Section: Methodsmentioning
confidence: 99%
“…Due to thermal cycling or mechanical stress, the solder joint may weaken or fail over time. On the other hand, if the temperature of the solder joint exceeds the target temperature, the electronic components being soldered may overheat, leading to oxidation, deformation, or even melting, which could also result in a decline in the quality of the solder joint [ 28 ]. Therefore, controlling the temperature of the solder joint is critically important in the laser soldering process.…”
Section: Methodsmentioning
confidence: 99%
“…Compared with traditional hand-soldering [1]- [3], HBS has several advantages, such as simple operation, simultaneous welding of multiple solder joints, good welding consistency, excellent welding quality, and easy automation. It is widely used for solder welding of printed circuit boards, flexible circuit boards, tinned flat copper wires, and coaxial cables [2], [4]- [8].…”
Section: Introductionmentioning
confidence: 99%
“…21 The collaborative optimization (CO) method minimizes the deviations between target value from system level and response value from sub-system level using compatibility constraints. [22][23][24][25][26][27][28][29] In this study, a coupling relationship coordination algorithm (CRCA) is integrated into the framework of MDO based on large-scale systems control and coordination strategy. In CRCA, whole system is divided into several sub-systems (disciplines) along discipline boundaries.…”
Section: Introductionmentioning
confidence: 99%