1999
DOI: 10.1109/16.760414
|View full text |Cite
|
Sign up to set email alerts
|

Numerical modeling of linear doping profiles for high-voltage thin-film SOI devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

4
25
0

Year Published

2005
2005
2024
2024

Publication Types

Select...
9
1

Relationship

0
10

Authors

Journals

citations
Cited by 92 publications
(29 citation statements)
references
References 8 publications
4
25
0
Order By: Relevance
“…By using which, devices with continuous and discrete doping profiles are analyzed. The analytical results agree well with results measured by [8], [9] and results simulated by MEDICI, a commercial TCAD tool. The simulation models used in MEDICI are CONSRH, AUGER, BGN, FLDMOB, IMPACT.…”
Section: Introductionsupporting
confidence: 83%
“…By using which, devices with continuous and discrete doping profiles are analyzed. The analytical results agree well with results measured by [8], [9] and results simulated by MEDICI, a commercial TCAD tool. The simulation models used in MEDICI are CONSRH, AUGER, BGN, FLDMOB, IMPACT.…”
Section: Introductionsupporting
confidence: 83%
“…This kind of concentration gradient is similar to the drift region zoning for a silicon LDMOS (lateral double diffusion metal oxide semiconductor). [23,24] The silicon is defined to dope into the AlGaN layer using ISE simulation software.…”
Section: Simulation Results and Discussionmentioning
confidence: 99%
“…Moreover, the first peaks are higher than the corresponding peaks at the drain end for both SOI and PSOI structures, implying that the RESURF effect is hardly to be perfectly achieved under small device dimensions and uniform doping drift region. Better RESURF can be achieved in devices of larger dimensions (Hu et al, 2012;Luo et al, 2008Luo et al, , 2010 or linear doping drift region (Guo, Li, & Zhang, 2006;Merchant, 1991;Shengdong, Sin, Lai, & Ko, 1999;Tadikonda et al, 2004), in which the surface electric fields at the source and drain ends are more symmetric and uniform. Figure 4(b).…”
Section: International Journal Of Electronics 39mentioning
confidence: 98%