2011
DOI: 10.1080/10407782.2011.609083
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Numerical Prediction of Product Deformation and Identification of Major Controlling Factors during the IML Process Including Thermal Impact

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Cited by 3 publications
(3 citation statements)
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“…The averaged deformation amounts along width and height are defined as W and H (Eqs. (13) and (14)) for battery cover, respectively, and similar procedure was also attempted for front cover. Figures 6(a) and 6(b) show numerical results with regard to the averaged deformation amounts along width, W, and height, H, for battery cover under the processing condition of cases 2 and 3 described in Table 1, respectively.…”
Section: Fig 5 Height Dimension Of Cad Model Experimental and Numermentioning
confidence: 99%
See 1 more Smart Citation
“…The averaged deformation amounts along width and height are defined as W and H (Eqs. (13) and (14)) for battery cover, respectively, and similar procedure was also attempted for front cover. Figures 6(a) and 6(b) show numerical results with regard to the averaged deformation amounts along width, W, and height, H, for battery cover under the processing condition of cases 2 and 3 described in Table 1, respectively.…”
Section: Fig 5 Height Dimension Of Cad Model Experimental and Numermentioning
confidence: 99%
“…Chen et al [12] numerically analyzed the thermal-induced residual stress distribution and related it with processing condition in injection molding. Lee et al [13] have used MOLDFLOW to simulate injection molding process and analyzed following thermal deformation with ABAQUS to investigate the deformation by in-mold labeling (IML) process. They concluded that thermal impact affects the residual stress of the part considered, thereby determining final deformation.…”
Section: Introductionmentioning
confidence: 99%
“…where y is the predicted response (bowing depth) and E is the correlation constant computed from the DOE analysis [19,20]. The full description of equation (1) can be used to predict the bowing depth within the range of inputs shown in Table 1.…”
Section: Doe Analysismentioning
confidence: 99%